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Epoxy composite with significantly improved thermal conductivity by constructing a vertically aligned three-dimensional network of silicon carbide nanowires/ boron nitride nanosheets

文献类型：期刊论文

作者Xiao, Chao2,4,5; Guo, Yujie1,3; Tang, Yunlu2,4,5; Ding, Jiwan2,4,5; Zhang, Xian2,4; Zheng, Kang2,4; Tian, Xingyou2,4
刊名COMPOSITES PART B-ENGINEERING
出版日期2020-04-15
卷号187
关键词Silicon carbide nanowires Boron nitride nanosheets Vertical alignment Thermal conductivity
ISSN号1359-8368
DOI10.1016/j.compositesb.2020.107855
通讯作者Zheng, Kang(kzheng@issp.ac.cn) ; Tian, Xingyou(xytian@issp.ac.cn)
英文摘要The trend of miniaturization, integration and multi-function of modern electronics leads to the speedily increased power density which makes heat dissipation a crucial issue. Herein, epoxy based composites with highly enhanced through-plane thermal conductivity were successfully prepared by constructing a free-standing and vertically aligned silicon carbide nanowires (SiCw)/functionalized boron nitride nanosheets (f-BNNS) framework through modified filtration strategy. The synergetic effect between hybrid fillers ensured highly efficient channels for phonons in vertical direction that the maximum thermal conductivity reached 4.22 W/mK at a low hybrid filler loading of 21.9 vol%, increased by 1658% in comparison to that of pure epoxy. Due to the entanglement effect of SiCw/f-BNNS framework and the enhanced interface interaction by BNNS modification, the interfacial thermal resistance between filler/filler and filler/matrix were both reduced a lot compared with random dispersion method. Exceptional heat dissipation capability of the vertically orientated architecture was also demonstrated by theoretical simulation and chip encapsulation applications. In addition, the coefficient of thermal expansion of composite reached as low as 41.1 ppm/degrees C, only half of the epoxy resin (83.5 ppm/degrees C). This work provides a novel strategy for fabricating polymer based composites with superior through-plane thermal conductivity in thermal management applications.
WOS关键词PHASE-CHANGE MATERIAL ; POLYMER COMPOSITES ; NANOCOMPOSITES ; ENHANCEMENT ; MANAGEMENT ; ALIGNMENT ; BN
资助项目National Key Research and Development Program of China[2017YFB0406200] ; Key Project of Science and Technology Service Network Initiative of the Chinese Academy of Sciences[KFJ-STS-ZDTP-069]
WOS研究方向Engineering ; Materials Science
语种英语
WOS记录号WOS:000521118100018
出版者ELSEVIER SCI LTD
资助机构National Key Research and Development Program of China ; Key Project of Science and Technology Service Network Initiative of the Chinese Academy of Sciences
源URL[http://ir.hfcas.ac.cn:8080/handle/334002/103597]  
专题中国科学院合肥物质科学研究院
通讯作者Zheng, Kang; Tian, Xingyou
作者单位1.Univ Chinese Acad Sci, Beijing 100049, Peoples R China
2.Chinese Acad Sci, Key Lab Photovolat & Energy Conservat Mat, Hefei 230031, Peoples R China
3.Chinese Acad Sci, Inst Semicond, Beijing 100083, Peoples R China
4.Chinese Acad Sci, Inst Appl Technol, Hefei Inst Phys Sci, Hefei 230031, Peoples R China
5.Univ Sci & Technol China, Hefei 230036, Peoples R China
推荐引用方式
GB/T 7714		 Xiao, Chao,Guo, Yujie,Tang, Yunlu,et al. Epoxy composite with significantly improved thermal conductivity by constructing a vertically aligned three-dimensional network of silicon carbide nanowires/ boron nitride nanosheets[J]. COMPOSITES PART B-ENGINEERING,2020,187.
APA Xiao, Chao.,Guo, Yujie.,Tang, Yunlu.,Ding, Jiwan.,Zhang, Xian.,...&Tian, Xingyou.(2020).Epoxy composite with significantly improved thermal conductivity by constructing a vertically aligned three-dimensional network of silicon carbide nanowires/ boron nitride nanosheets.COMPOSITES PART B-ENGINEERING,187.
MLA Xiao, Chao,et al."Epoxy composite with significantly improved thermal conductivity by constructing a vertically aligned three-dimensional network of silicon carbide nanowires/ boron nitride nanosheets".COMPOSITES PART B-ENGINEERING 187(2020).

入库方式： OAI收割

来源：合肥物质科学研究院

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