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Preparation and characterization of epoxy-based composite with multilayered structure and high thermal conductivity

文献类型：期刊论文

作者Chen, Lu1,2,3; Xiao, Chao1,2,3; Tang, Yunlu1,2,3; Zhang, Xian1,2; Zheng, Kang1,2; Tian, Xingyou1,2
刊名MATERIALS RESEARCH EXPRESS
出版日期2019-07-01
卷号6
关键词epoxy h-BN multilayered structure thermally conductive path thermal conductivity
ISSN号2053-1591
DOI10.1088/2053-1591/ab1370
通讯作者Zheng, Kang(kzheng@issp.ac.cn) ; Tian, Xingyou(xytian@issp.ac.cn)
英文摘要A multilayered thermally conductive composite with ternary system of heat conductive fillers-thermally conductive films-epoxy matrix was prepared through a facile process of layer-by-layer stacking, pre-curing and hot-pressing. The thermally conductive films (boron nitride nanosheets/cellulose nanofiber) with high in-plane thermal conductivities were employed as the heat conductive medium, while the platelet-shaped hexagonal boron nitride and the particle-shaped aluminum nitride were utilized as heat conductive fillers for enhancing the perfection of the thermally conductive network. A horizontally heat conductive network was constructed within the epoxy matrix under the joint contribution of the horizontally aligned hexagonal boron nitride platelets and the parallelly spread thermally conductive films through hot-pressing. The aluminum nitride particles acted as linking points, filling the gaps between hexagonal boron nitride platelets, while constructing the thermally conductive path in the vertical direction. Thanks to the introduction of thermally conductive films and the good orientation of boron nitride platelets, the in-plane thermal conductivities of the composites increased with increasing of film layer number. With film layer number of 9, and filler content of 30 wt% (aluminum nitride/boron nitride (1:1)), the in-plane thermal conductivity of the composite was as high as 8.53Wm(-1) * K, which showed an enhancement of 4165% than that of the pure epoxy matrix, and an improvement of 613% compared to that of the composite without multilayered structure. Meanwhile, the out-of-plane thermal conductivity exhibited a slightly deceased tendency as film layer number increased, but it still reached 0.87 Wm(-1) * K with film layer number of 9, which was 335% higher than that of the pure epoxy. In addition, the multilayered composite also possessed good thermal stability, enhanced stiffness, as well as low dielectric constant and dielectric loss, which shows a potential application in thermal management for packaging of integrated circuit and microelectronic devices.
WOS关键词HEXAGONAL BORON-NITRIDE ; DYNAMIC-MECHANICAL PROPERTIES ; POLYMER COMPOSITES ; HIGH-EFFICIENCY ; NANOCOMPOSITES ; ORIENTATION ; MATRIX ; FILMS ; ALN ; NANOMATERIALS
资助项目National KeyR&DProgram of China[2017YFB0406200]
WOS研究方向Materials Science
语种英语
WOS记录号WOS:000517575400001
出版者IOP PUBLISHING LTD
资助机构National KeyR&DProgram of China
源URL[http://ir.hfcas.ac.cn:8080/handle/334002/103871]  
专题中国科学院合肥物质科学研究院
通讯作者Zheng, Kang; Tian, Xingyou
作者单位1.Chinese Acad Sci, Key Lab Photovolta & Energy Conservat Mat, Hefei, Peoples R China
2.Chinese Acad Sci, Inst Appl Technol, Hefei Inst Phys Sci, Hefei 230088, Peoples R China
3.Univ Sci & Technol China, Hefei 3006, Peoples R China
推荐引用方式
GB/T 7714		 Chen, Lu,Xiao, Chao,Tang, Yunlu,et al. Preparation and characterization of epoxy-based composite with multilayered structure and high thermal conductivity[J]. MATERIALS RESEARCH EXPRESS,2019,6.
APA Chen, Lu,Xiao, Chao,Tang, Yunlu,Zhang, Xian,Zheng, Kang,&Tian, Xingyou.(2019).Preparation and characterization of epoxy-based composite with multilayered structure and high thermal conductivity.MATERIALS RESEARCH EXPRESS,6.
MLA Chen, Lu,et al."Preparation and characterization of epoxy-based composite with multilayered structure and high thermal conductivity".MATERIALS RESEARCH EXPRESS 6(2019).

入库方式： OAI收割

来源：合肥物质科学研究院

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