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Construction of low melting point alloy/graphene three-dimensional continuous thermal conductive pathway for improving in-plane and through-plane thermal conductivity of poly(vinylidene fluoride) composites

文献类型：期刊论文

作者Zhang, Ping1,5,6; Zhang, Xian3,4,5,6; Ding, Xin5,6; Wang, Yanyan1,5,6; Shu, Mengting1,5,6; Zeng, Xiaoliang2,3,4; Gong, Yi5,6; Zheng, Kang5,6; Tian, Xingyou3,4,5,6
刊名NANOTECHNOLOGY
出版日期2020-11-20
卷号31
ISSN号0957-4484
关键词low melting point alloy graphene thermal management interface thermal resistance
DOI10.1088/1361-6528/abaf82
通讯作者Zhang, Xian(xzhang@issp.ac.cn) ; Zeng, Xiaoliang(xl.zeng@siat.ac.cn) ; Tian, Xingyou(xytian@issp.ac.cn)
英文摘要As the temperature of hot spots increases in electronic devices, thermal management is a key issue for maintaining a device's reliability and performance. The usual approaches of quickly extracting the heat from the hot spots have focused on aligning two-dimensional filler along the in-plane orientation in the polymer matrix. Meanwhile, improving the through-plane thermal conductivity of polymer-based composites is as important as in-plane thermal conductivity. In this study, poly(vinylidene fluoride) composites with three-dimensional continuous thermal conductive pathways of a low melting point alloy (LMPA)/graphene were prepared through a two-step method. Poly(vinylidene fluoride)@graphene (PVDF@Gr) microspheres were firstly prepared by an in-situ water-vapor induced phase separation method. Subsequently, PVDF@Gr/LMPA composites were obtained by hot-pressing after mixing the LMPA with the PVDF@Gr microspheres. Attributed to the unique solid-liquid phase transition advantage of the LMPA and the good matching of the phonon power spectrum between the LMPA and the graphene, the PVDF@4.8Gr/10LMPA composites with 4.8 vol% graphene and 10.0 vol% LMPA exhibited an outstanding in-plane thermal conductivity of 9.41 W m(-1)K(-1)and through-plane thermal conductivity of 0.35 W m(-1)K(-1), which was nearly increased by 245% and 130% compared to that of the PVDF@4.8Gr composites, respectively. The enhanced elasticity modulus and reduced thermal expansion coefficient were attributed to the LMPA constructing a three-dimensional continuous thermal conductive pathway along with the graphene and reducing interface thermal resistance. This study offeres a straightforward and repeatable method for fabricating highly thermally conductive polymer composites and widens the application of LMPAs in the fields of thermal management.
WOS关键词POLYMER COMPOSITE ; GRAPHENE SHEETS ; FILM ; NANOCOMPOSITES ; ORIENTATION ; ALIGNMENT ; ALLOY
资助项目National Key Research and Development Program of China[2017YFB0406200] ; Key Project of Science and Technology Service Network Initiative of the Chinese Academy of Sciences[KFJ-STS-ZDTP-069] ; Anhui Province Key Laboratory of Environment-friendly Polymer Materials
WOS研究方向Science & Technology - Other Topics ; Materials Science ; Physics
语种英语
出版者IOP PUBLISHING LTD
WOS记录号WOS:000570311900001
资助机构National Key Research and Development Program of China ; Key Project of Science and Technology Service Network Initiative of the Chinese Academy of Sciences ; Anhui Province Key Laboratory of Environment-friendly Polymer Materials
源URL[http://ir.hfcas.ac.cn:8080/handle/334002/104109]  
专题中国科学院合肥物质科学研究院
通讯作者Zhang, Xian; Zeng, Xiaoliang; Tian, Xingyou
作者单位1.Univ Sci & Technol China, Hefei 262300, Peoples R China
2.Chinese Acad Sci, Shenzhen Inst Adv Technol, Shenzhen Inst Adv Elect Mat, Shenzhen 518055, Peoples R China
3.2221 Changjiang West Rd, Hefei, Anhui, Peoples R China
4.Xili Shenzhen Univ Town, 1068 Xueyuan Ave, Shenzhen, Peoples R China
5.Chinese Acad Sci, Hefei Inst Phys Sci, Inst Solid State Phys, Hefei 230031, Peoples R China
6.Chinese Acad Sci, Key Lab Photovolat & Energy Conservat Mat, Hefei 230088, Peoples R China
推荐引用方式
GB/T 7714		 Zhang, Ping,Zhang, Xian,Ding, Xin,et al. Construction of low melting point alloy/graphene three-dimensional continuous thermal conductive pathway for improving in-plane and through-plane thermal conductivity of poly(vinylidene fluoride) composites[J]. NANOTECHNOLOGY,2020,31.
APA Zhang, Ping.,Zhang, Xian.,Ding, Xin.,Wang, Yanyan.,Shu, Mengting.,...&Tian, Xingyou.(2020).Construction of low melting point alloy/graphene three-dimensional continuous thermal conductive pathway for improving in-plane and through-plane thermal conductivity of poly(vinylidene fluoride) composites.NANOTECHNOLOGY,31.
MLA Zhang, Ping,et al."Construction of low melting point alloy/graphene three-dimensional continuous thermal conductive pathway for improving in-plane and through-plane thermal conductivity of poly(vinylidene fluoride) composites".NANOTECHNOLOGY 31(2020).

入库方式： OAI收割

来源：合肥物质科学研究院

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