A hybrid adhesive bonding of PMMA and PCB with an application on microchip electrophoresis
文献类型：期刊论文
| 作者 | Chang, Yongjia1,2; You, Hui2
|
| 刊名 | ANALYTICAL METHODS
 |
| 出版日期 | 2019-03-07 |
| 卷号 | 11期号:9页码:1229-1236 |
| ISSN号 | 1759-9660 |
| DOI | 10.1039/c8ay02642d |
| 通讯作者 | You, Hui(usmlhy@iim.ac.cn) |
| 英文摘要 | In the development of microfluidics, integration of different materials is becoming critical, especially when the integration of fluidic and electronic components is needed. In this work, a hybrid adhesive bonding method combining adhesive and thermal bonding is proposed. It uses a pressure sensitive adhesive (PSA) tape for integration of a polymethyl methacrylate (PMMA) film and printed circuit board (PCB) substrate while a PMMA microchannel layer is bonded with PMMA film through thermal bonding. The simple bonding process can reliably integrate electronic circuits and fluidic components without any expensive equipment. The relationship between pressure applied during adhesive bonding and the bond ratio is investigated as well as the influence of pressure upon the remaining channel depth during thermocompression. The bond strength is also studied with a dead-end channel test and flow rate test ranging from 20 mu l min(-1) to 500 mu l min(-1). The results demonstrate a strong bond formed between the two different layers using the hybrid technique. As an application, a microchip for electrophoresis detection is tested. Successful separation of different ions and a comparable level of the relative standard deviation (RSD) for the migration time and the peak height imply the reliability of the bonding protocol and the good potential for a wide range of applications in the future. |
| WOS关键词 | MICROFLUIDIC DEVICES ; FABRICATION ; CHIPS |
| 资助项目 | Strategic Priority Research Program of the Chinese Academy of Sciences[XDA08040109] |
| WOS研究方向 | Chemistry ; Food Science & Technology ; Spectroscopy |
| 语种 | 英语 |
| WOS记录号 | WOS:000459906000009 |
| 出版者 | ROYAL SOC CHEMISTRY |
| 资助机构 | Strategic Priority Research Program of the Chinese Academy of Sciences ; Strategic Priority Research Program of the Chinese Academy of Sciences ; Strategic Priority Research Program of the Chinese Academy of Sciences ; Strategic Priority Research Program of the Chinese Academy of Sciences ; Strategic Priority Research Program of the Chinese Academy of Sciences ; Strategic Priority Research Program of the Chinese Academy of Sciences ; Strategic Priority Research Program of the Chinese Academy of Sciences ; Strategic Priority Research Program of the Chinese Academy of Sciences |
| 源URL | [http://ir.hfcas.ac.cn:8080/handle/334002/42248]  |
| 专题 | 合肥物质科学研究院_中科院固体物理研究所 |
| 通讯作者 | You, Hui |
| 作者单位 | 1.Univ Sci & Technol China, Hefei 230026, Anhui, Peoples R China 2.Chinese Acad Sci, Inst Intelligent Machines, Hefei 230031, Anhui, Peoples R China |
| 推荐引用方式 GB/T 7714 | Chang, Yongjia,You, Hui. A hybrid adhesive bonding of PMMA and PCB with an application on microchip electrophoresis[J]. ANALYTICAL METHODS,2019,11(9):1229-1236. |
| APA | Chang, Yongjia,&You, Hui.(2019).A hybrid adhesive bonding of PMMA and PCB with an application on microchip electrophoresis.ANALYTICAL METHODS,11(9),1229-1236. |
| MLA | Chang, Yongjia,et al."A hybrid adhesive bonding of PMMA and PCB with an application on microchip electrophoresis".ANALYTICAL METHODS 11.9(2019):1229-1236. |
入库方式： OAI收割
来源：合肥物质科学研究院
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。