Comparison study of gold coatings prepared by traditional and modified galvanic replacement deposition for corrosion prevention of copper
文献类型：期刊论文
| 作者 | Xingkai Zhang3 ; Qingyi Qian1; Li Qiang3; Bin Zhang2,3; Junyan Zhang2,3
|
| 刊名 | Microelectronics Reliability
 |
| 出版日期 | 2020-05-13 |
| 期号 | 110页码:113695 |
| 语种 | 英语 |
| 源URL | [http://ir.licp.cn/handle/362003/26758]  |
| 专题 | 兰州化学物理研究所_先进润滑与防护材料研究发展中心 |
| 通讯作者 | Bin Zhang |
| 作者单位 | 1.Lanzhou University of Technology 2.University of Chinese Academy of Sciences 3.Lanzhou Institute of Chemical Physics, Chinese Academy of Sciences |
| 推荐引用方式 GB/T 7714 | Xingkai Zhang,Qingyi Qian,Li Qiang,et al. Comparison study of gold coatings prepared by traditional and modified galvanic replacement deposition for corrosion prevention of copper[J]. Microelectronics Reliability,2020(110):113695. |
| APA | Xingkai Zhang,Qingyi Qian,Li Qiang,Bin Zhang,&Junyan Zhang.(2020).Comparison study of gold coatings prepared by traditional and modified galvanic replacement deposition for corrosion prevention of copper.Microelectronics Reliability(110),113695. |
| MLA | Xingkai Zhang,et al."Comparison study of gold coatings prepared by traditional and modified galvanic replacement deposition for corrosion prevention of copper".Microelectronics Reliability .110(2020):113695. |
入库方式： OAI收割
来源：兰州化学物理研究所
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