Application of pressure regulation in CCOS polishing technology
文献类型：会议论文
| 作者 | Ye, Fengfei1,2,3; Wan, Yongjian3; Yu, Deping2; Liu, Haitao3 |
| 出版日期 | 2019 |
| 会议日期 | June 26, 2018 - June 29, 2018 |
| 会议地点 | Chengdu, China |
| 关键词 | Optical Processing CCOS Pressure Regulation Grinding and polishing |
| 卷号 | 10838 |
| DOI | 10.1117/12.2504877 |
| 页码 | 108380F |
| 英文摘要 | In grinding and polishing of the aspherical and freeform surface, the CCOS technology is widely used. It is a process during which errors can be corrected quantificationally by a small tool that can follow the local curves of the aspherical and freeform surface. It commonly uses constant pressure during polishing, and thus the desired amount of material to be remove depends on the dwell time. This thesis the pressure regulation is introduced into the CCOS polishing system. The pressure can be controlled in real time in the process of processing, and the application of pressure control in CCOS polishing is realized. The main characteristic of this technology is that the desired amount of material to be removed is controlled by both the polishing pressure and the dwell time. Firstly, a mathematical model was established for the variable pressure polishing process. Then the machining efficiency and the influence of pressure error on machining quality are simulated and analyzed. Finally, a material removal experiment that applied sinusoidal pressure was carried out on a K9 material mirror. Results showed that frequency of the measured pressure is the same as that of the ideal sinusoidal polishing pressure. The spatial period of the measured surface profile is the same as that of surface profile obtained by simulation of the sinusoidal polishing process. The surface profile error is within 17%. In this thesis, variable pressure polishing was achieved. Compared with the constant pressure CCOS polishing technology, the variable pressure CCOS polishing technology adds one more degree of freedom to the polishing process. It need have higher requirements for the pressure active control system, such as the output pressure range, response speed and precision. These performance parameters can affect the processing results. Therefore the key to developing the variable pressure CCOS polishing technology is to research the polishing tool, which must have high performance pressure active control system. © 2019 COPYRIGHT SPIE. Downloading of the abstract is permitted for personal use only. |
| 会议录 | Proceedings of SPIE 10838 - 9th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies
 |
| 会议录出版者 | SPIE |
| 文献子类 | 会议论文 |
| 语种 | 英语 |
| ISSN号 | 0277-786X |
| WOS研究方向 | Engineering, Manufacturing ; Optics |
| WOS记录号 | WOS:000459715700014 |
| 源URL | [http://ir.ioe.ac.cn/handle/181551/9607]  |
| 专题 | 光电技术研究所_先光中心 |
| 作者单位 | 1.University of Chinese Academy of Sciences, Beijing; 100049, China 2.Sichuan University, School of Manufacturing Science and Engineering, Chengdu; 610065, China; 3.Institute of Optics and Electronics, Chinese Academy of Sciences, Chengdu; 610209, China; |
| 推荐引用方式 GB/T 7714 | Ye, Fengfei,Wan, Yongjian,Yu, Deping,et al. Application of pressure regulation in CCOS polishing technology[C]. 见:. Chengdu, China. June 26, 2018 - June 29, 2018. |
入库方式： OAI收割
来源：光电技术研究所
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