Bi segregation at interface of the eutectic SnBi/Cu solder joint
文献类型：期刊论文
| 作者 | Liu, CZ; Zhang, W; Sui, ML; Shang, JK |
| 刊名 | ACTA METALLURGICA SINICA
 |
| 出版日期 | 2005-08-01 |
| 卷号 | 41期号:8页码:847-852 |
| 关键词 | eutectic SnBi/Cu solder joint segregation interfacial reaction Pb-free solder |
| ISSN号 | 0412-1961 |
| 通讯作者 | Liu, CZ(czliu@imr.ac.cn) |
| 英文摘要 | The interfacial microstructure of eutectic SnBi/Cu interconnect was examined by SEM, TEM and XRD. It was found that after aging at 120 degrees C for 7 d, the intermetallic compound (IMC) at the interface evolved from Cu6Sn5 plus Cu3Sn and the thickness of IMC layer increased from 2 mu m to 10 mu m. TEM observation revealed a number of Bi particles with size of about 100 nm distributed along the Cu3Sn/Cu interface in the aged interconnect. Micro-force testing of interconnects indicated that upon aging, the fracture toughness KIC of the interconnect decreased greatly and fracture mode changed from ductile to brittle. While the crack path was along the interface between IMC and solder in the as-reflowed condition, it was shifted to the interface between Cu3Sn and Cu substrate after aging. By comparing with the same interface in the pure Sn/Cu interconnect aged at 220 degrees C for 5 d, it was conclused that the presence of Bi particles is responsible for the embrittlement of the interface. The Bi-induced embrittlement presents a serious concern over the suitability of Bi-containing Pb-free solders for microelectronic packaging. |
| WOS研究方向 | Metallurgy & Metallurgical Engineering |
| 语种 | 英语 |
| WOS记录号 | WOS:000231652000013 |
| 出版者 | SCIENCE PRESS |
| 源URL | [http://ir.imr.ac.cn/handle/321006/84523]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 通讯作者 | Liu, CZ |
| 作者单位 | 1.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China 2.Shenyang Inst Aeronaut Engn, Dept Mat Engn, Shenyang 110034, Peoples R China 3.Univ Illinois, Dept Mat Sci & Engn, Urbana, IL 61801 USA |
| 推荐引用方式 GB/T 7714 | Liu, CZ,Zhang, W,Sui, ML,et al. Bi segregation at interface of the eutectic SnBi/Cu solder joint[J]. ACTA METALLURGICA SINICA,2005,41(8):847-852. |
| APA | Liu, CZ,Zhang, W,Sui, ML,&Shang, JK.(2005).Bi segregation at interface of the eutectic SnBi/Cu solder joint.ACTA METALLURGICA SINICA,41(8),847-852. |
| MLA | Liu, CZ,et al."Bi segregation at interface of the eutectic SnBi/Cu solder joint".ACTA METALLURGICA SINICA 41.8(2005):847-852. |
入库方式： OAI收割
来源：金属研究所
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