Investigation of the relationship between annealing temperature and yield strength in Cu film by in-situ XRD stress analysis method
文献类型:期刊论文
作者 | Qin, M; Ji, V; Wu, YN; Ma, SY; Li, JB |
刊名 | RESIDUAL STRESSES VII, PROCEEDINGS
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出版日期 | 2005 |
卷号 | 490-491页码:595-600 |
关键词 | Cu film annealing temperature yield strength biaxial stresses X-ray tensile test |
ISSN号 | 0255-5476 |
通讯作者 | Qin, M(mqin@imr.ac.cn) |
WOS研究方向 | Materials Science ; Metallurgy & Metallurgical Engineering |
语种 | 英语 |
WOS记录号 | WOS:000230305200102 |
出版者 | TRANS TECH PUBLICATIONS LTD |
源URL | [http://ir.imr.ac.cn/handle/321006/85293] ![]() |
专题 | 金属研究所_中国科学院金属研究所 |
通讯作者 | Qin, M |
作者单位 | Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, SYNL, Shenyang 110016, Peoples R China |
推荐引用方式 GB/T 7714 | Qin, M,Ji, V,Wu, YN,et al. Investigation of the relationship between annealing temperature and yield strength in Cu film by in-situ XRD stress analysis method[J]. RESIDUAL STRESSES VII, PROCEEDINGS,2005,490-491:595-600. |
APA | Qin, M,Ji, V,Wu, YN,Ma, SY,&Li, JB.(2005).Investigation of the relationship between annealing temperature and yield strength in Cu film by in-situ XRD stress analysis method.RESIDUAL STRESSES VII, PROCEEDINGS,490-491,595-600. |
MLA | Qin, M,et al."Investigation of the relationship between annealing temperature and yield strength in Cu film by in-situ XRD stress analysis method".RESIDUAL STRESSES VII, PROCEEDINGS 490-491(2005):595-600. |
入库方式: OAI收割
来源:金属研究所
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