中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Investigation of the relationship between annealing temperature and yield strength in Cu film by in-situ XRD stress analysis method

文献类型:期刊论文

作者Qin, M; Ji, V; Wu, YN; Ma, SY; Li, JB
刊名RESIDUAL STRESSES VII, PROCEEDINGS
出版日期2005
卷号490-491页码:595-600
关键词Cu film annealing temperature yield strength biaxial stresses X-ray tensile test
ISSN号0255-5476
通讯作者Qin, M(mqin@imr.ac.cn)
WOS研究方向Materials Science ; Metallurgy & Metallurgical Engineering
语种英语
WOS记录号WOS:000230305200102
出版者TRANS TECH PUBLICATIONS LTD
源URL[http://ir.imr.ac.cn/handle/321006/85293]  
专题金属研究所_中国科学院金属研究所
通讯作者Qin, M
作者单位Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, SYNL, Shenyang 110016, Peoples R China
推荐引用方式
GB/T 7714
Qin, M,Ji, V,Wu, YN,et al. Investigation of the relationship between annealing temperature and yield strength in Cu film by in-situ XRD stress analysis method[J]. RESIDUAL STRESSES VII, PROCEEDINGS,2005,490-491:595-600.
APA Qin, M,Ji, V,Wu, YN,Ma, SY,&Li, JB.(2005).Investigation of the relationship between annealing temperature and yield strength in Cu film by in-situ XRD stress analysis method.RESIDUAL STRESSES VII, PROCEEDINGS,490-491,595-600.
MLA Qin, M,et al."Investigation of the relationship between annealing temperature and yield strength in Cu film by in-situ XRD stress analysis method".RESIDUAL STRESSES VII, PROCEEDINGS 490-491(2005):595-600.

入库方式: OAI收割

来源:金属研究所

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