Enhancing adhesion between diamond film and WC-Co substrate
文献类型：期刊论文
| 作者 | Li Jianguo; Hu Dongping; Mei Jun; Liu Shi; Li Yiyi |
| 刊名 | ACTA METALLURGICA SINICA
 |
| 出版日期 | 2006-07-11 |
| 卷号 | 42期号:7页码:763-769 |
| 关键词 | composite diamond film WC-Co adhesion Murakami solution H-2 plasma |
| ISSN号 | 0412-1961 |
| 通讯作者 | Li Jianguo(jiangli@imr.ac.cn) |
| 英文摘要 | The effects of Murakami solution and H-2 plasma treatment on the surface morphology and structure of WC-Co alloy have been investigated by using of SEM and XRD. The adhesion of the pretreated WC-Co tools coated with composite diamond film was evaluated with indentation method and drilling test. The results show that the composite diamond film consisted of nanocrystalline and microcrystalline has uniform surface morphologies and low roughness. The Murakami solution treatment induced uniform and fine grooves on the surface of WC-Co tool, as a result, the critical load between diamond film and substrate reached about 1.5 kN, which was examined with indentation method, but this kind of drill does not possess a good cutting performance. H-2 plasma treatment promoted WC grain more coarse and compact, the critical load between diamond film and this treated tool is over 1.5 kN and this kind of drill has excellent cutting performance. |
| WOS研究方向 | Metallurgy & Metallurgical Engineering |
| 语种 | 英语 |
| WOS记录号 | WOS:000239402500016 |
| 出版者 | SCIENCE CHINA PRESS |
| 源URL | [http://ir.imr.ac.cn/handle/321006/86311]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 通讯作者 | Li Jianguo |
| 作者单位 | 1.China Acad Engn Phys, Inst Struct Mech, Mianyang 621900, Peoples R China 2.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China |
| 推荐引用方式 GB/T 7714 | Li Jianguo,Hu Dongping,Mei Jun,et al. Enhancing adhesion between diamond film and WC-Co substrate[J]. ACTA METALLURGICA SINICA,2006,42(7):763-769. |
| APA | Li Jianguo,Hu Dongping,Mei Jun,Liu Shi,&Li Yiyi.(2006).Enhancing adhesion between diamond film and WC-Co substrate.ACTA METALLURGICA SINICA,42(7),763-769. |
| MLA | Li Jianguo,et al."Enhancing adhesion between diamond film and WC-Co substrate".ACTA METALLURGICA SINICA 42.7(2006):763-769. |
入库方式： OAI收割
来源：金属研究所
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