Dewetting of SnAgCu lead-free solder liquid on non-wetting line
文献类型：期刊论文
| 作者 | Wang Fuxue; Zhang Lei; Shi Chunyuan; Shang Jianku |
| 刊名 | ACTA METALLURGICA SINICA
 |
| 出版日期 | 2006-12-01 |
| 卷号 | 42期号:12页码:1298-1302 |
| 关键词 | lead-free solder solder bridge wetting dewetting |
| ISSN号 | 0412-1961 |
| 通讯作者 | Zhang Lei(lzhang@imr.ac.cn) |
| 英文摘要 | Specific non-wetting lines with a definite width of 200 mu m were prepared on copper substrates. The dewetting of SnAgCu lead-free liquids on the non-wetting line was observed and recorded in situ during the reflow of the samples. It was found that the shapes of the solder liquids varied with the height of the printed solder paste. As the height decreased from 950 mu m, the separation length of the liquid along the non wetting line was elongated gradually. For the solder paste with a height of 350 mu m, the liquid sphere cap was completely separated by the non-wetting line. The dependence of the critical height of the solder liquid on the width of non-wetting line was proposed based on interfacial energy minimization. The experiment agreed with the critical height for a 200 mu m non-wetting line calculated accordingly. These results gave a clear hint on the origin of solder bridging. |
| WOS研究方向 | Metallurgy & Metallurgical Engineering |
| 语种 | 英语 |
| WOS记录号 | WOS:000243417000013 |
| 出版者 | SCIENCE CHINA PRESS |
| 源URL | [http://ir.imr.ac.cn/handle/321006/87099]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 通讯作者 | Zhang Lei |
| 作者单位 | 1.Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Met Res Inst, Shenyang 110016, Peoples R China 2.Dalian Jiaotong Univ, Sch Mat Sci & Engn, Dalian 116028, Peoples R China |
| 推荐引用方式 GB/T 7714 | Wang Fuxue,Zhang Lei,Shi Chunyuan,et al. Dewetting of SnAgCu lead-free solder liquid on non-wetting line[J]. ACTA METALLURGICA SINICA,2006,42(12):1298-1302. |
| APA | Wang Fuxue,Zhang Lei,Shi Chunyuan,&Shang Jianku.(2006).Dewetting of SnAgCu lead-free solder liquid on non-wetting line.ACTA METALLURGICA SINICA,42(12),1298-1302. |
| MLA | Wang Fuxue,et al."Dewetting of SnAgCu lead-free solder liquid on non-wetting line".ACTA METALLURGICA SINICA 42.12(2006):1298-1302. |
入库方式： OAI收割
来源：金属研究所
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