Microstructure and fracture of Pb-free solder interconnects in CBGA packages under thermal cycling
文献类型：期刊论文
| 作者 | Wang, W; Wang, ZG; Xian, AP; Shang, JK |
| 刊名 | ACTA METALLURGICA SINICA
 |
| 出版日期 | 2006-06-01 |
| 卷号 | 42期号:6页码:647-652 |
| 关键词 | Pb-free solder interconnect ceramic ball grid array (CBGA) finite element method thermal cycling |
| ISSN号 | 0412-1961 |
| 通讯作者 | Wang, ZG() |
| 英文摘要 | Microstructure and thermal fatigue behavior of Pb-free solder interconnects in ceramic ball grid array (CBGA) packages were examined by cross-sectional microscopy, thermal cycling experiments and finite element modeling. In the as-reflowed condition, Cu6Sn5 and Ag3Sn formed at the solder interfaces with Cu and Ag metallizations respectively. Following thermal cycling, the Cu6Sn5 layer grew thicker and Cu3Sn was found at the interface with Cu metallization. On the ceramic side, visible thickening of the Ag3Sn layer was also observed. The morphology of Ag3Sn in the solder near the interface changed from strip-like to spherical shape. As a result of repeatedly thermal cycling, the fatigue crack appeared first at the corner of the solder ball with the chip, where the maximum shear stress was found by the finite element analysis. The cracks preferred to propagate along the Cu6Sn5/solder interface on the side of the print circuit board and in the solder joint near the interfacial Ag3Sn layer on the ceramic side. |
| WOS研究方向 | Metallurgy & Metallurgical Engineering |
| 语种 | 英语 |
| WOS记录号 | WOS:000238725300015 |
| 出版者 | SCIENCE CHINA PRESS |
| 源URL | [http://ir.imr.ac.cn/handle/321006/87646]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 通讯作者 | Wang, ZG |
| 作者单位 | 1.Univ Illinois, Dept Mat & Engn, Urbana, IL 61801 USA 2.Chinese Acad Sci, Met Res Inst, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China |
| 推荐引用方式 GB/T 7714 | Wang, W,Wang, ZG,Xian, AP,et al. Microstructure and fracture of Pb-free solder interconnects in CBGA packages under thermal cycling[J]. ACTA METALLURGICA SINICA,2006,42(6):647-652. |
| APA | Wang, W,Wang, ZG,Xian, AP,&Shang, JK.(2006).Microstructure and fracture of Pb-free solder interconnects in CBGA packages under thermal cycling.ACTA METALLURGICA SINICA,42(6),647-652. |
| MLA | Wang, W,et al."Microstructure and fracture of Pb-free solder interconnects in CBGA packages under thermal cycling".ACTA METALLURGICA SINICA 42.6(2006):647-652. |
入库方式： OAI收割
来源：金属研究所
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