Effect of intermetallics Ag3Sn on the tensile property of Sn3.8Ag0.7Cu solder alloy
文献类型：期刊论文
| 作者 | Zhu Qingsheng; Zhang Li; Wang Zhongguang; Wu Shiding; Shang Jianku |
| 刊名 | ACTA METALLURGICA SINICA
 |
| 出版日期 | 2007 |
| 卷号 | 43期号:1页码:41-46 |
| 关键词 | Pb-free solder Sn3.8Ag0.7Cu alloy intermetallics equal channel angular pressing mechanical property |
| ISSN号 | 0412-1961 |
| 通讯作者 | Wang Zhongguang(zhgwang@imx.ac.cn) |
| 英文摘要 | Sn3.8Ag0.7Cu alloys containing Ag3Sn intermetallic compound (IMC) with different morphologies, sizes and distributions were prepared by controlling cooling rate during solidification and equal channel angle pressing process (ECAP). The relation between mechanical property of the alloys and IMC phase was investigated. The tensile stress-strain curves of the alloys with different, i-nicrostructures were compared and the deformed microstructures were observed by SEM and TEM. While the large needle-like Ag3Sn was found to provide fiber-strengthening effect to the alloy, its brittle fracture promoted void nucleation, resulting in a deterioration of tensile elongation. The fine particles of Ag3Sn produced by ECAP enhanced dispersion strengthening by blocking the dislocation motion. The particles on the boundaries of fine equiaxed Sn grains inhibited the boundary sliding, leading to improvement of the tensile strength. |
| WOS研究方向 | Metallurgy & Metallurgical Engineering |
| 语种 | 英语 |
| WOS记录号 | WOS:000244315000008 |
| 出版者 | SCIENCE CHINA PRESS |
| 源URL | [http://ir.imr.ac.cn/handle/321006/92450]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 通讯作者 | Wang Zhongguang |
| 作者单位 | 1.Univ Illinois, Dept Mat Sci & Engn, Urbana, IL 61801 USA 2.Chinese Acad Sci, Met Res Inst, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China |
| 推荐引用方式 GB/T 7714 | Zhu Qingsheng,Zhang Li,Wang Zhongguang,et al. Effect of intermetallics Ag3Sn on the tensile property of Sn3.8Ag0.7Cu solder alloy[J]. ACTA METALLURGICA SINICA,2007,43(1):41-46. |
| APA | Zhu Qingsheng,Zhang Li,Wang Zhongguang,Wu Shiding,&Shang Jianku.(2007).Effect of intermetallics Ag3Sn on the tensile property of Sn3.8Ag0.7Cu solder alloy.ACTA METALLURGICA SINICA,43(1),41-46. |
| MLA | Zhu Qingsheng,et al."Effect of intermetallics Ag3Sn on the tensile property of Sn3.8Ag0.7Cu solder alloy".ACTA METALLURGICA SINICA 43.1(2007):41-46. |
入库方式： OAI收割
来源：金属研究所
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