MODELING OF Ag3Sn COARSENING AND ITS EFFECT ON CREEP IN Sn-Ag-Cu SOLDER
文献类型：期刊论文
| 作者 | Wang Xiaojing1; Zhu Qingsheng1; Wang Zhongguang1; Shang Jianku1,2 |
| 刊名 | ACTA METALLURGICA SINICA
 |
| 出版日期 | 2009-08-11 |
| 卷号 | 45期号:8页码:912-918 |
| 关键词 | Pb-free solder particle coarsening electric current |
| ISSN号 | 0412-1961 |
| 通讯作者 | Wang Zhongguang(zhgwang@imr.ac.cn) |
| 英文摘要 | Coarsening of the microstructure in Sn-Ag-Cu (SAC) solder joints under current stressing was observed experimentally and modeled by a dislocation-creep model which incorporates the coarsening of second phase particles in lead-free solder alloys. Both the effects of electric current and strain-enhanced coarsening were considered in this model. The straining effect took into account of both the inelastic-strain history and hydrostatic constraint. The model describes well the evolution of the eutectic microstructure and the predictions of the model agree reasonably well with experimentally observed trends. |
| 资助项目 | National Basic Research Program of China[2004CB619306] |
| WOS研究方向 | Metallurgy & Metallurgical Engineering |
| 语种 | 英语 |
| WOS记录号 | WOS:000269601400003 |
| 出版者 | SCIENCE PRESS |
| 资助机构 | National Basic Research Program of China |
| 源URL | [http://ir.imr.ac.cn/handle/321006/96202]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 通讯作者 | Wang Zhongguang |
| 作者单位 | 1.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China 2.Univ Illinois, Dept Mat Sci & Engn, Urbana, IL 61801 USA |
| 推荐引用方式 GB/T 7714 | Wang Xiaojing,Zhu Qingsheng,Wang Zhongguang,et al. MODELING OF Ag3Sn COARSENING AND ITS EFFECT ON CREEP IN Sn-Ag-Cu SOLDER[J]. ACTA METALLURGICA SINICA,2009,45(8):912-918. |
| APA | Wang Xiaojing,Zhu Qingsheng,Wang Zhongguang,&Shang Jianku.(2009).MODELING OF Ag3Sn COARSENING AND ITS EFFECT ON CREEP IN Sn-Ag-Cu SOLDER.ACTA METALLURGICA SINICA,45(8),912-918. |
| MLA | Wang Xiaojing,et al."MODELING OF Ag3Sn COARSENING AND ITS EFFECT ON CREEP IN Sn-Ag-Cu SOLDER".ACTA METALLURGICA SINICA 45.8(2009):912-918. |
入库方式： OAI收割
来源：金属研究所
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