First-principles Investigation of Bi Segregation at the Solder Interface of Cu/Cu3Sn(010)
文献类型：期刊论文
| 作者 | Pang, X. Y.1; Liu, Z. Q.1; Wang, S. Q.1; Shang, J. K.1,2 |
| 刊名 | JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
 |
| 出版日期 | 2010-12-01 |
| 卷号 | 26期号:12页码:1057-1062 |
| 关键词 | First-principles calculation Segregation Bismuth Interface SnBi solder |
| ISSN号 | 1005-0302 |
| 通讯作者 | Liu, Z. Q.(zqliu@imr.ac.cn) |
| 英文摘要 | Density functional theory was employed to investigate the bismuth segregation at Cu/Cu3Sn(010) interface. Five initial constructions were introduced by adopting the adhesion energy criterion. Among them, the so-called "between-Cu" construction in which the interface Cu atoms of Cu slab locate along Cu-Cu bond direction in Cu3Sn slab was found to be the most energy-favored at an adhesion energy of 1.96 J/m(2). Based on this construction, five possible segregation sites were examined, and the most likely segregation site was determined with adhesion energy as low as 1.06 J/m(2), which was almost half of the initial one. Comparing with other sites' adhesion energies, it was concluded that size effect took a large part in embrittlement. The analyses of atomic structure and electronic density revealed that the slabs shifted away from interfaces due to bismuth segregation, and the atoms around Bi atom were pressed away. This calculated work agreed qualitatively with reported experimental results. |
| 资助项目 | National Basic Research Program of China[2006CB605103] ; National Basic Research Program of China[2010CB631006] ; Chinese Academy of Sciences ; Liaoning Natural Science Foundation of China[20082015] |
| WOS研究方向 | Materials Science ; Metallurgy & Metallurgical Engineering |
| 语种 | 英语 |
| WOS记录号 | WOS:000286153900001 |
| 出版者 | JOURNAL MATER SCI TECHNOL |
| 资助机构 | National Basic Research Program of China ; Chinese Academy of Sciences ; Liaoning Natural Science Foundation of China |
| 源URL | [http://ir.imr.ac.cn/handle/321006/102660]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 通讯作者 | Liu, Z. Q. |
| 作者单位 | 1.Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Peoples R China 2.Univ Illinois, Dept Mat Sci & Engn, Urbana, IL 61801 USA |
| 推荐引用方式 GB/T 7714 | Pang, X. Y.,Liu, Z. Q.,Wang, S. Q.,et al. First-principles Investigation of Bi Segregation at the Solder Interface of Cu/Cu3Sn(010)[J]. JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,2010,26(12):1057-1062. |
| APA | Pang, X. Y.,Liu, Z. Q.,Wang, S. Q.,&Shang, J. K..(2010).First-principles Investigation of Bi Segregation at the Solder Interface of Cu/Cu3Sn(010).JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,26(12),1057-1062. |
| MLA | Pang, X. Y.,et al."First-principles Investigation of Bi Segregation at the Solder Interface of Cu/Cu3Sn(010)".JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY 26.12(2010):1057-1062. |
入库方式： OAI收割
来源：金属研究所
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