MEASUREMENTS OF HARDNESS AND ELASTIC MODULUS OF Cu THIN FILM BY MEANS OF NANOINDENTATION
文献类型：期刊论文
| 作者 | Li Yesheng1; Wang Wei2 |
| 刊名 | ACTA METALLURGICA SINICA
 |
| 出版日期 | 2010-09-11 |
| 卷号 | 46期号:9页码:1098-1102 |
| 关键词 | nanoindentation Cu film hardness elastic modulus |
| ISSN号 | 0412-1961 |
| DOI | 10.3724/SP.J.1037.2009.00859 |
| 通讯作者 | Li Yesheng(nfyyliyesheng@tom.com) |
| 英文摘要 | Hardness (H) and elastic modulus (E) of 1 mu m thick Cu film deposited on Si substrate were measured by means of nanoindentation technique. The E value of Cu film obtained by using single stiffness measurement (SSM) is consistent with that obtained from continuous stiffness measurement (CSM). However, the H value obtained from SSM is much smaller than that from CSM because of occurrence of significant creep during the holding period at ambient temperature. The analysis of loading curves shows that the substrate effect on hardness measurement appears as the indentation depth is about 528-587 nm, indicating the ratio of penetration depth to film thickness (about 0.5) is consistent with the finite element calculation. |
| 资助项目 | National Natural Science Foundation of China[50571097] ; Natural Science Foundation of Jiangxi Province[2007GZC0712] |
| WOS研究方向 | Metallurgy & Metallurgical Engineering |
| 语种 | 英语 |
| WOS记录号 | WOS:000282804800012 |
| 出版者 | SCIENCE CHINA PRESS |
| 资助机构 | National Natural Science Foundation of China ; Natural Science Foundation of Jiangxi Province |
| 源URL | [http://ir.imr.ac.cn/handle/321006/102695]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 通讯作者 | Li Yesheng |
| 作者单位 | 1.Jiangxi Univ Sci & Technol, Sch Mat Sci & Chem Engn, Ganzhou 341000, Peoples R China 2.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China |
| 推荐引用方式 GB/T 7714 | Li Yesheng,Wang Wei. MEASUREMENTS OF HARDNESS AND ELASTIC MODULUS OF Cu THIN FILM BY MEANS OF NANOINDENTATION[J]. ACTA METALLURGICA SINICA,2010,46(9):1098-1102. |
| APA | Li Yesheng,&Wang Wei.(2010).MEASUREMENTS OF HARDNESS AND ELASTIC MODULUS OF Cu THIN FILM BY MEANS OF NANOINDENTATION.ACTA METALLURGICA SINICA,46(9),1098-1102. |
| MLA | Li Yesheng,et al."MEASUREMENTS OF HARDNESS AND ELASTIC MODULUS OF Cu THIN FILM BY MEANS OF NANOINDENTATION".ACTA METALLURGICA SINICA 46.9(2010):1098-1102. |
入库方式： OAI收割
来源：金属研究所
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