STUDY ON VOID HEALING BEHAVIOR DURING FORGING PROCESS FOR 25Cr2Ni4MoV STEEL
文献类型：期刊论文
| 作者 | Li Shijian; Sun Mingyue; Liu Hongwei; Li Dianzhong |
| 刊名 | ACTA METALLURGICA SINICA
 |
| 出版日期 | 2011-07-11 |
| 卷号 | 47期号:7页码:946-953 |
| 关键词 | steel 25Cr2Ni4MoV forging void healing bonding efficiency simulation |
| ISSN号 | 0412-1961 |
| DOI | 10.3724/SP.J.1037.2011.00157 |
| 通讯作者 | Li Dianzhong(dzli@imr.ac.cn) |
| 英文摘要 | Based on the measured stress-strain curves and thermo-physical data of 25Cr2Ni4MoV steel, a FEM model of void closure in heavy forging process was established through ABAQUS software. The void closure behaviors under different hot plasticity conditions have been investigated. The FEM results showed three distinct stages during the void closure. The voids with the same position in a cylindrical specimen close up at a similar height reduction ratio (Delta H/H(0)) around 25% at different temperatures, which indicates that the void closure is not sensitive to the deformation temperature. On basis of the FEM results, a physical-simulated experiment for void bonding process has been performed through compression tests on a hollow cylindrical specimens, with deformation temperatures ranging from 900 V to 1200 degrees C, Delta H/H(0) from 25% to 45% and a constant strain rate 0.01 s(-1). The experimental results have shown that the Delta H/H(0) for the void completely bonded at 1200, 1100 and 1000 degrees C are all about 35%, but increases to 45% when the deformation temperature decreased to 900 degrees C, which confirms that void bonding is a diffusion controlled process. Through the experimental results, it can be further demonstrated the high temperature combined with severe deformation can enhance the ability of atoms transition and decrease the micro-gap between contacted surfaces. Finally, the influencing factors on the bonding efficiency were investigated through SEM observation on the fractured surface of the tensile specimen with internal closed void. |
| WOS研究方向 | Metallurgy & Metallurgical Engineering |
| 语种 | 英语 |
| WOS记录号 | WOS:000294980700030 |
| 出版者 | SCIENCE PRESS |
| 源URL | [http://ir.imr.ac.cn/handle/321006/104349]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 通讯作者 | Li Dianzhong |
| 作者单位 | Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Peoples R China |
| 推荐引用方式 GB/T 7714 | Li Shijian,Sun Mingyue,Liu Hongwei,et al. STUDY ON VOID HEALING BEHAVIOR DURING FORGING PROCESS FOR 25Cr2Ni4MoV STEEL[J]. ACTA METALLURGICA SINICA,2011,47(7):946-953. |
| APA | Li Shijian,Sun Mingyue,Liu Hongwei,&Li Dianzhong.(2011).STUDY ON VOID HEALING BEHAVIOR DURING FORGING PROCESS FOR 25Cr2Ni4MoV STEEL.ACTA METALLURGICA SINICA,47(7),946-953. |
| MLA | Li Shijian,et al."STUDY ON VOID HEALING BEHAVIOR DURING FORGING PROCESS FOR 25Cr2Ni4MoV STEEL".ACTA METALLURGICA SINICA 47.7(2011):946-953. |
入库方式： OAI收割
来源：金属研究所
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