Effect of solution temperature on aging behavior and properties of SiCp/Al-Cu-Mg composites
文献类型：期刊论文
| 作者 | Jin, P.; Xiao, B. L.; Wang, Q. Z.; Ma, Z. Y.; Liu, Y.; Li, S. |
| 刊名 | MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
 |
| 出版日期 | 2011-01-25 |
| 卷号 | 528期号:3页码:1504-1511 |
| 关键词 | Composites Aluminum alloys Aging Powder metallurgy Solution-treatment |
| ISSN号 | 0921-5093 |
| DOI | 10.1016/j.msea.2010.10.075 |
| 通讯作者 | Ma, Z. Y.(zyma@imr.ac.cn) |
| 英文摘要 | In this study, the effect of solution temperature on artificial aging kinetics of 15 vol.% SiC particles reinforced 2009Al (SiCp/2009Al) composite prepared using a powder metallurgy method was investigated by means of microstructural examinations, hardness measurement and DSC analyses. The study indicated that, with increasing the solution temperature from 495 to 560 degrees C, while the GP zone formation and dissolution were retarded due to the decreased quenched-in vacancy concentration, the S' precipitation was promoted due to the increased dislocation density. This accelerated the aging kinetics of the composite with increasing the solution temperature from 495 to 560 degrees C. Furthermore, the composite which was solutionized at 530 degrees C exhibited the highest peak hardness and tensile strength. The effect of the solution temperature on the aging behavior and tensile properties of the composite was explained in terms of the variation of the microstructual mechanisms. (C) 2010 Elsevier B.V. All rights reserved. |
| WOS研究方向 | Science & Technology - Other Topics ; Materials Science ; Metallurgy & Metallurgical Engineering |
| 语种 | 英语 |
| WOS记录号 | WOS:000286904300103 |
| 出版者 | ELSEVIER SCIENCE SA |
| 源URL | [http://ir.imr.ac.cn/handle/321006/106748]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 通讯作者 | Ma, Z. Y. |
| 作者单位 | Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Peoples R China |
| 推荐引用方式 GB/T 7714 | Jin, P.,Xiao, B. L.,Wang, Q. Z.,et al. Effect of solution temperature on aging behavior and properties of SiCp/Al-Cu-Mg composites[J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,2011,528(3):1504-1511. |
| APA | Jin, P.,Xiao, B. L.,Wang, Q. Z.,Ma, Z. Y.,Liu, Y.,&Li, S..(2011).Effect of solution temperature on aging behavior and properties of SiCp/Al-Cu-Mg composites.MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,528(3),1504-1511. |
| MLA | Jin, P.,et al."Effect of solution temperature on aging behavior and properties of SiCp/Al-Cu-Mg composites".MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 528.3(2011):1504-1511. |
入库方式： OAI收割
来源：金属研究所
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