Electro-deposition of Sn-Ag lead-free solder by alkaline pyrophosphate bath
文献类型：期刊论文
| 作者 | Qiao, M; Xian, AP; Shang, JK |
| 刊名 | ACTA METALLURGICA SINICA
 |
| 出版日期 | 2004-08-01 |
| 卷号 | 40期号:8页码:822-826 |
| 关键词 | lead-free solder electroplating Sn-Ag alloy microelectronic packaging |
| ISSN号 | 0412-1961 |
| 通讯作者 | Xian, AP() |
| 英文摘要 | In the road-line map of the lead-free soldering for electronic packaging, the development and application of the lead-free solder coating on Cu matrix is a key step. In this paper, an alkaline pyrophosphate bath and the electroplating processing is developed for a Sn-Ag lead-free solder coating. The research results are focused at effects of the bath composition and the processing parameters on silver content and morphology of the coating, the processing parameters include cathodic current density, bath temperature and agitation. |
| WOS研究方向 | Metallurgy & Metallurgical Engineering |
| 语种 | 英语 |
| WOS记录号 | WOS:000223695400008 |
| 出版者 | SCIENCE CHINA PRESS |
| 源URL | [http://ir.imr.ac.cn/handle/321006/119017]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 通讯作者 | Xian, AP |
| 作者单位 | 1.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China 2.Univ Illinois, Dept Mat Sci & Engn, Urbana, IL 61801 USA |
| 推荐引用方式 GB/T 7714 | Qiao, M,Xian, AP,Shang, JK. Electro-deposition of Sn-Ag lead-free solder by alkaline pyrophosphate bath[J]. ACTA METALLURGICA SINICA,2004,40(8):822-826. |
| APA | Qiao, M,Xian, AP,&Shang, JK.(2004).Electro-deposition of Sn-Ag lead-free solder by alkaline pyrophosphate bath.ACTA METALLURGICA SINICA,40(8),822-826. |
| MLA | Qiao, M,et al."Electro-deposition of Sn-Ag lead-free solder by alkaline pyrophosphate bath".ACTA METALLURGICA SINICA 40.8(2004):822-826. |
入库方式： OAI收割
来源：金属研究所
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