Relationship between the yield strength and annealing temperature of a Cu film adherent to substrate
文献类型：期刊论文
| 作者 | Qin, M; Ji, V; Li, JB; Ma, SY; Chen, CR; Song, ZX; He, JW |
| 刊名 | ACTA METALLURGICA SINICA
 |
| 出版日期 | 2004-07-01 |
| 卷号 | 40期号:7页码:716-720 |
| ISSN号 | 0412-1961 |
| 关键词 | Cu film biaxial stress yield strength annealing temperature X-ray tensile test |
| 通讯作者 | Qin, M(mqin@imr.ac.cn) |
| 英文摘要 | Using X-ray tensile test, the relationship between the yield strength and annealing temperature for a Cu film with biaxial residual stress adherent to substrate was investigated. The results indicate that the proof stress of the film decreases with increasing annealing temperature. When annealing temperature rose from 150 degreesC to 300 degreesC, the decreasing amplitude of proof stress is the largest. The reason of this phenomenon is that recrystallization in film occurred at 300 degreesC, and a majority of structure strengthening effects disappeared. The yield strength of the Cu film on the steel substrate is greatly higher than that of block Cu. |
| WOS研究方向 | Metallurgy & Metallurgical Engineering |
| 语种 | 英语 |
| 出版者 | SCIENCE CHINA PRESS |
| WOS记录号 | WOS:000222938000008 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/119689]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 通讯作者 | Qin, M |
| 作者单位 | 1.Xian Jiaotong Univ, State Key Lab Mech Behav Mat, Xian 710049, Peoples R China 2.Ecole Natl Super Arts & Metiers, LM3 ESA CNRS 8006, F-75013 Paris, France 3.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China |
| 推荐引用方式 GB/T 7714 | Qin, M,Ji, V,Li, JB,et al. Relationship between the yield strength and annealing temperature of a Cu film adherent to substrate[J]. ACTA METALLURGICA SINICA,2004,40(7):716-720. |
| APA | Qin, M.,Ji, V.,Li, JB.,Ma, SY.,Chen, CR.,...&He, JW.(2004).Relationship between the yield strength and annealing temperature of a Cu film adherent to substrate.ACTA METALLURGICA SINICA,40(7),716-720. |
| MLA | Qin, M,et al."Relationship between the yield strength and annealing temperature of a Cu film adherent to substrate".ACTA METALLURGICA SINICA 40.7(2004):716-720. |
入库方式： OAI收割
来源：金属研究所
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