Progress in Thermal Fatigue of Micro/Nano-Scale Metal Conductors
文献类型：期刊论文
| 作者 | Zhang Guangping1; Chen Honglei1,3; Luo Xuemei1; Zhang Bin2 |
| 刊名 | ACTA METALLURGICA SINICA
 |
| 出版日期 | 2018-03-11 |
| 卷号 | 54期号:3页码:357-366 |
| 关键词 | thin metal film interconnect alternating current thermal fatigue size effect |
| ISSN号 | 0412-1961 |
| DOI | 10.11900/0412.1961.2017.00371 |
| 通讯作者 | Zhang Guangping(gpzhang@imr.ac.cn) |
| 英文摘要 | The world has gradually entered the industrial 4.0 Era, which is dominated by the Internet of Things (IOT) and intelligent manufacturing. Especially, strong requirement for artificial intelligence and big data processing, the development and preparation of micro/nano electronic devices is becoming increasingly active, and much more concerns have been attracted to small-scale materials. Because of the constraint effect of geometric and microstructural dimensions of these materials, the thermal fatigue damage behavior is different from that of the bulk counterparts. At the same time, the change of the material scale from microns to nanometers also results in the transformation of the deformation mechanism, so that the materials exhibit different damage behaviors and significant size effects. In this paper, thermal fatigue testing methods, thermal fatigue damage and evolution, and the factors influencing thermal fatigue properties of metal film/line are reviewed, the corresponding mechanism of thermal fatigue and the size effect of the micro/nano-scale metals are discussed. The prospective research of this field in the future is addressed. |
| 资助项目 | National Natural Science Foundation of China[51371047] ; National Natural Science Foundation of China[51671050] ; National Natural Science Foundation of China[51601198] |
| WOS研究方向 | Metallurgy & Metallurgical Engineering |
| 语种 | 英语 |
| WOS记录号 | WOS:000427121400001 |
| 出版者 | SCIENCE PRESS |
| 资助机构 | National Natural Science Foundation of China |
| 源URL | [http://ir.imr.ac.cn/handle/321006/127495]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 通讯作者 | Zhang Guangping |
| 作者单位 | 1.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Liaoning, Peoples R China 2.Northeastern Univ, Sch Mat Sci & Engn, Minist Educ, Key Lab Anisotropy & Texture Mat, Shenyang 110819, Liaoning, Peoples R China 3.Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Liaoning, Peoples R China |
| 推荐引用方式 GB/T 7714 | Zhang Guangping,Chen Honglei,Luo Xuemei,et al. Progress in Thermal Fatigue of Micro/Nano-Scale Metal Conductors[J]. ACTA METALLURGICA SINICA,2018,54(3):357-366. |
| APA | Zhang Guangping,Chen Honglei,Luo Xuemei,&Zhang Bin.(2018).Progress in Thermal Fatigue of Micro/Nano-Scale Metal Conductors.ACTA METALLURGICA SINICA,54(3),357-366. |
| MLA | Zhang Guangping,et al."Progress in Thermal Fatigue of Micro/Nano-Scale Metal Conductors".ACTA METALLURGICA SINICA 54.3(2018):357-366. |
入库方式： OAI收割
来源：金属研究所
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