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Brittle-to-ductile transition of Au2Al and AuAl2 intermetallic compounds in wire bonding

文献类型：期刊论文

作者Yang, Haokun1,2; Cao, Ke1; Zhao, XiaoTian4; Liu, Wei4; Lu, Jian1,2,3; Lu, Yang1,2,3
刊名JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
出版日期2019
卷号30期号:1页码:862-866
ISSN号0957-4522
DOI10.1007/s10854-018-0357-6
通讯作者Lu, Jian(jianlu@cityu.edu.hk) ; Lu, Yang(yanglu@cityu.edu.hk)
英文摘要Au-Al intermetallic compounds (IMCs) were conventionally regarded as damage sources within wire bonding interfaces. Among the Au-Al IMCs system, Au2Al and AuAl2 IMCs were commonly observed after long-term service. Here, the intrinsic mechanical properties of Au2Al and AuAl2 IMCs were investigated by in-situ bending tests. The results clearly revealed that the transition from brittle to ductile facture behavior was determined by the atomic ratio of Au and Al elements, while Al-rich Au-Al IMC exhibits higher bending strength than that of Au-rich Au-Al IMC. The Al-rich Au-Al IMC such as AuAl2 indeed showed brittle fracture behavior, in which cracks propagated through the grain boundaries. In contrast, the Au-rich Au-Al IMC such as Au2Al appeared to be quite ductile and crack resistant, and its plastic deformation was undertaken by slip bands. This work suggested that not all Au-Al IMCs cause brittleness and lead to damages, only Al-rich IMCs should be avoided at wire bonding interfaces.
资助项目National Key R&D Program of China[2017YFA0204403] ; Shenzhen Virtual University Park[R-IND1710] ; Innovation and Technology Commission via the Hong Kong Branch of National Precious Metals Material Engineering Research Center ; Research Grants Council of the Hong Kong Special Administrative Region, China[CityU 11209914] ; Research Grants Council of the Hong Kong Special Administrative Region, China[11247516] ; Province-Institute/Province-College Cooperation Project[2017IB016] ; SZSTI[JSGG20141020103826038] ; Hong Kong Branch of National Precious Metals Material Engineering Research Centre
WOS研究方向Engineering ; Materials Science ; Physics
语种英语
WOS记录号WOS:000456048800092
出版者SPRINGER
资助机构National Key R&D Program of China ; Shenzhen Virtual University Park ; Innovation and Technology Commission via the Hong Kong Branch of National Precious Metals Material Engineering Research Center ; Research Grants Council of the Hong Kong Special Administrative Region, China ; Province-Institute/Province-College Cooperation Project ; SZSTI ; Hong Kong Branch of National Precious Metals Material Engineering Research Centre
源URL[http://ir.imr.ac.cn/handle/321006/131459]  
专题金属研究所_中国科学院金属研究所
通讯作者Lu, Jian; Lu, Yang
作者单位1.City Univ Hong Kong, Hong Kong Branch, Natl Precious Met Mat Engn Res Ctr, 83 Tat Chee Ave, Hong Kong, Peoples R China
2.City Univ Hong Kong, Dept Mech Engn, 83 Tat Chee Ave, Hong Kong, Peoples R China
3.City Univ Hong Kong, Ctr Adv Struct Mat, Shenzhen Res Inst, 8 Yuexing 1st Rd, Shenzhen, Peoples R China
4.Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, 72 Wenhua Rd, Shenyang 110016, Liaoning, Peoples R China
推荐引用方式
GB/T 7714		 Yang, Haokun,Cao, Ke,Zhao, XiaoTian,et al. Brittle-to-ductile transition of Au2Al and AuAl2 intermetallic compounds in wire bonding[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2019,30(1):862-866.
APA Yang, Haokun,Cao, Ke,Zhao, XiaoTian,Liu, Wei,Lu, Jian,&Lu, Yang.(2019).Brittle-to-ductile transition of Au2Al and AuAl2 intermetallic compounds in wire bonding.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,30(1),862-866.
MLA Yang, Haokun,et al."Brittle-to-ductile transition of Au2Al and AuAl2 intermetallic compounds in wire bonding".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 30.1(2019):862-866.

入库方式： OAI收割

来源：金属研究所

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