Evolution of the interfacial microstructure during the plastic deformation bonding of copper
文献类型：期刊论文
| 作者 | Zhang, Jian Yang1,2; Sun, Ming Yue1,3,4; Xu, Bin1,3,4; Hu, Xin5; Liu, Sheng1,2; Xie, Bi Jun1,2; Li, Dian Zhong1,3 |
| 刊名 | MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
 |
| 出版日期 | 2019-02-11 |
| 卷号 | 746页码:1-10 |
| 关键词 | Copper bonding Hot compression bonding Dynamic recrystallization Grain boundary Dislocation wall |
| ISSN号 | 0921-5093 |
| DOI | 10.1016/j.msea.2018.12.119 |
| 通讯作者 | Sun, Ming Yue(mysun@imr.ac.cn) |
| 英文摘要 | In order to clarify the bonding mechanism by plastic deformation of two similar materials, the microstructural evolution of the copper-copper interface by hot compression was investigated in detail. Particular attention was given to the development of new recrystallized grains in the bonding area and the elimination of the bonding line by the migration of interfacial grain boundaries (IGBs) during the hot compression process. The evolution of new grains in the matrix and the interface occur via different types of dynamic recrystallization (DRX). The former is associated with the grain boundary bulging and the latter is related to a strain induced substructure. This substructure is composed of a dislocation wall, and is transformed into recrystallized grain by the evolution of high angular misorientations after increasing strain. Two types of interfaces with different grain size features, such as a fine-fine grain or a fine-coarse grain interface, will be generated owing to different degrees of re crystallization occurring at the interface. The bonding mechanisms of the two different structural interfaces are also discussed. |
| 资助项目 | National Key Research and Development Program[2016YFB0300401] ; National Natural Science Foundation of China[U1508215] ; National Natural Science Foundation of China[51774265] ; Key Program of the Chinese Academy of Sciences[ZDRW-CN-2017-1] |
| WOS研究方向 | Science & Technology - Other Topics ; Materials Science ; Metallurgy & Metallurgical Engineering |
| 语种 | 英语 |
| WOS记录号 | WOS:000458227900001 |
| 出版者 | ELSEVIER SCIENCE SA |
| 资助机构 | National Key Research and Development Program ; National Natural Science Foundation of China ; Key Program of the Chinese Academy of Sciences |
| 源URL | [http://ir.imr.ac.cn/handle/321006/131519]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 通讯作者 | Sun, Ming Yue |
| 作者单位 | 1.Chinese Acad Sci, Inst Met Res, 72 Wenhua Rd, Shenyang 110016, Liaoning, Peoples R China 2.Univ Sci & Technol China, Sch Mat Sci & Engn, 72 Wenhua Rd, Shenyang 110016, Liaoning, Peoples R China 3.Shenyang Natl Lab Mat Sci, 72 Wenhua Rd, Shenyang 110016, Liaoning, Peoples R China 4.Chinese Acad Sci, Key Lab Nucl Mat & Safety Assessment, Inst Met Res, 72 Wenhua Rd, Shenyang 110016, Liaoning, Peoples R China 5.Yanshan Univ, Sch Mech Engn, 438 HeBei Rd, Qinhuangdao 066004, Peoples R China |
| 推荐引用方式 GB/T 7714 | Zhang, Jian Yang,Sun, Ming Yue,Xu, Bin,et al. Evolution of the interfacial microstructure during the plastic deformation bonding of copper[J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,2019,746:1-10. |
| APA | Zhang, Jian Yang.,Sun, Ming Yue.,Xu, Bin.,Hu, Xin.,Liu, Sheng.,...&Li, Dian Zhong.(2019).Evolution of the interfacial microstructure during the plastic deformation bonding of copper.MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,746,1-10. |
| MLA | Zhang, Jian Yang,et al."Evolution of the interfacial microstructure during the plastic deformation bonding of copper".MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 746(2019):1-10. |
入库方式： OAI收割
来源：金属研究所
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