中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
A new quantizing insulator soldering technology scheme for microwave module

文献类型:期刊论文

作者Tian, Fei-Fei1,2; Zhou, Ming2; Zhang, Jun Zhi2
刊名MICROWAVE AND OPTICAL TECHNOLOGY LETTERS
出版日期2019-04-01
卷号61期号:4页码:979-984
关键词microwave module quatization soldering solid solder ring
ISSN号0895-2477
DOI10.1002/mop.31680
通讯作者Tian, Fei-Fei(fftian@alum.imr.ac.cn)
英文摘要A new quantizing technology scheme of insulator soldering was presented comparing with traditional soldering technology using solder paste, based on utilization of solid solder ring and the consideration of insulator mounting hole design on the microwave module shell. The X-ray test on void ratio of insulator soldering shows that there exists no penetration void and the void ratio is below 5%. According to the leak standard A4 of GJB 548B-1014.2, the standard leak rate of microwave module after the insulator soldering was below 5 x 10(-9)(Pa center dot m(3))/s. After 10 cycles of temperature shock test ranging from -55 degrees C to 125 degrees C, the standard leak rate of microwave module was still below 5 x 10(-9) (Pa center dot m(3))/s. In comparison with traditional insulator soldering technology using solder paste, through utilization of solid solder ring and the design of insulator mounting hole, this new technology quantized the soldering of insulator so as to resolve the existing defects of traditional insulator soldering such as solder overflow, high void ratio, shortcut and channel blocking. The quantized insulator sealed soldering technology ensured the reliability, air impermeability, uniformity and beautifulness of soldering meanwhile improved operators' efficiency.
WOS研究方向Engineering ; Optics
语种英语
WOS记录号WOS:000460571000023
出版者WILEY
源URL[http://ir.imr.ac.cn/handle/321006/132195]  
专题金属研究所_中国科学院金属研究所
通讯作者Tian, Fei-Fei
作者单位1.Chinese Acad Sci, Inst Met Res, Shenyang, Liaoning, Peoples R China
2.Nanjing Elect Devices Inst, Nanjing 210016, Jiangsu, Peoples R China
推荐引用方式
GB/T 7714
Tian, Fei-Fei,Zhou, Ming,Zhang, Jun Zhi. A new quantizing insulator soldering technology scheme for microwave module[J]. MICROWAVE AND OPTICAL TECHNOLOGY LETTERS,2019,61(4):979-984.
APA Tian, Fei-Fei,Zhou, Ming,&Zhang, Jun Zhi.(2019).A new quantizing insulator soldering technology scheme for microwave module.MICROWAVE AND OPTICAL TECHNOLOGY LETTERS,61(4),979-984.
MLA Tian, Fei-Fei,et al."A new quantizing insulator soldering technology scheme for microwave module".MICROWAVE AND OPTICAL TECHNOLOGY LETTERS 61.4(2019):979-984.

入库方式: OAI收割

来源:金属研究所

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