A new quantizing insulator soldering technology scheme for microwave module
文献类型:期刊论文
作者 | Tian, Fei-Fei1,2; Zhou, Ming2; Zhang, Jun Zhi2 |
刊名 | MICROWAVE AND OPTICAL TECHNOLOGY LETTERS
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出版日期 | 2019-04-01 |
卷号 | 61期号:4页码:979-984 |
关键词 | microwave module quatization soldering solid solder ring |
ISSN号 | 0895-2477 |
DOI | 10.1002/mop.31680 |
通讯作者 | Tian, Fei-Fei(fftian@alum.imr.ac.cn) |
英文摘要 | A new quantizing technology scheme of insulator soldering was presented comparing with traditional soldering technology using solder paste, based on utilization of solid solder ring and the consideration of insulator mounting hole design on the microwave module shell. The X-ray test on void ratio of insulator soldering shows that there exists no penetration void and the void ratio is below 5%. According to the leak standard A4 of GJB 548B-1014.2, the standard leak rate of microwave module after the insulator soldering was below 5 x 10(-9)(Pa center dot m(3))/s. After 10 cycles of temperature shock test ranging from -55 degrees C to 125 degrees C, the standard leak rate of microwave module was still below 5 x 10(-9) (Pa center dot m(3))/s. In comparison with traditional insulator soldering technology using solder paste, through utilization of solid solder ring and the design of insulator mounting hole, this new technology quantized the soldering of insulator so as to resolve the existing defects of traditional insulator soldering such as solder overflow, high void ratio, shortcut and channel blocking. The quantized insulator sealed soldering technology ensured the reliability, air impermeability, uniformity and beautifulness of soldering meanwhile improved operators' efficiency. |
WOS研究方向 | Engineering ; Optics |
语种 | 英语 |
WOS记录号 | WOS:000460571000023 |
出版者 | WILEY |
源URL | [http://ir.imr.ac.cn/handle/321006/132195] ![]() |
专题 | 金属研究所_中国科学院金属研究所 |
通讯作者 | Tian, Fei-Fei |
作者单位 | 1.Chinese Acad Sci, Inst Met Res, Shenyang, Liaoning, Peoples R China 2.Nanjing Elect Devices Inst, Nanjing 210016, Jiangsu, Peoples R China |
推荐引用方式 GB/T 7714 | Tian, Fei-Fei,Zhou, Ming,Zhang, Jun Zhi. A new quantizing insulator soldering technology scheme for microwave module[J]. MICROWAVE AND OPTICAL TECHNOLOGY LETTERS,2019,61(4):979-984. |
APA | Tian, Fei-Fei,Zhou, Ming,&Zhang, Jun Zhi.(2019).A new quantizing insulator soldering technology scheme for microwave module.MICROWAVE AND OPTICAL TECHNOLOGY LETTERS,61(4),979-984. |
MLA | Tian, Fei-Fei,et al."A new quantizing insulator soldering technology scheme for microwave module".MICROWAVE AND OPTICAL TECHNOLOGY LETTERS 61.4(2019):979-984. |
入库方式: OAI收割
来源:金属研究所
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