Highly Thermally Conducting Polymer-Based Films with Magnetic Field-Assisted Vertically Aligned Hexagonal Boron Nitride for Flexible Electronic Encapsulation
文献类型：期刊论文
| 作者 | Yuan, Jie2,3; Qian, Xitang2,3; Meng, Zhichao2,3; Yang, Bo1; Liu, Zhi-Quan2,3,4 |
| 刊名 | ACS APPLIED MATERIALS & INTERFACES
 |
| 出版日期 | 2019-05-15 |
| 卷号 | 11期号:19页码:17915-17924 |
| ISSN号 | 1944-8244 |
| 关键词 | hexagonal boron nitride nanosheets (hBNNs) magnetic FeCo nanocubes electrostatic interactions vertically orientation thermal conductivity |
| DOI | 10.1021/acsami.9b06062 |
| 通讯作者 | Liu, Zhi-Quan(zqliu@siat.ac.cn) |
| 英文摘要 | Here, a facile, low-cost, and high-efficiency method to construct a vertically aligned hexagonal boron nitride nanosheet (hBNN) thermal conduction channel structure is proposed to improve the thermal conductivity. First, exfoliated negatively charged BNNs and positively charged FeCo nanocubes self-assemble to form complex nanomaterials by strong electrostatic interactions. Then, the BNNs can orient with FeCo nanocubes in magnetic field, and the {001} facets of BNNs adsorb on the {100} facets of FeCo nanocubes. The large scale range and high-density FeCo/hBN-aligned structures are observed by scanning electron microscopy, which can act as thermal dissipation channels by conveying more phonons through a preponderant thermally conductive direction. The thermal conductivity of the composite films with 30 wt % FeCo and 50 wt % BN filler is 2.25 W m(-1) K-1, 7 times higher than that of the films only containing 50 wt % randomly distributed hBN filler (0.325 W m(-1) K-1) and 20 times higher than pure polydimethylsiloxane films (0.114 W m(-1) K-1). The thermal management capability of the composite films is evaluated as a thermal conducting substrate of a light-emitting diode chip and the infrared thermal technology. Apart from the surprising thermal conductivity, FeCo-BNNs composite films also exhibit superb flexibility. |
| 资助项目 | National Key R&D Project from Minister of Science and Technology of China[2017YFB0406000] ; National Natural Science Foundation of China[51601033] ; Shenzhen International Cooperation Project[GJHZ20180420180909654] |
| WOS研究方向 | Science & Technology - Other Topics ; Materials Science |
| 语种 | 英语 |
| 出版者 | AMER CHEMICAL SOC |
| WOS记录号 | WOS:000468364500087 |
| 资助机构 | National Key R&D Project from Minister of Science and Technology of China ; National Natural Science Foundation of China ; Shenzhen International Cooperation Project |
| 源URL | [http://ir.imr.ac.cn/handle/321006/133377]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 通讯作者 | Liu, Zhi-Quan |
| 作者单位 | 1.Northeastern Univ, Sch Mat Sci & Engn, Minist Educ, Key Lab Anisotropy & Texture Mat, Shenyang 110819, Liaoning, Peoples R China 2.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China 3.Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Liaoning, Peoples R China 4.Chinese Acad Sci, Shenzhen Inst Adv Technol, Shenzhen 518055, Peoples R China |
| 推荐引用方式 GB/T 7714 | Yuan, Jie,Qian, Xitang,Meng, Zhichao,et al. Highly Thermally Conducting Polymer-Based Films with Magnetic Field-Assisted Vertically Aligned Hexagonal Boron Nitride for Flexible Electronic Encapsulation[J]. ACS APPLIED MATERIALS & INTERFACES,2019,11(19):17915-17924. |
| APA | Yuan, Jie,Qian, Xitang,Meng, Zhichao,Yang, Bo,&Liu, Zhi-Quan.(2019).Highly Thermally Conducting Polymer-Based Films with Magnetic Field-Assisted Vertically Aligned Hexagonal Boron Nitride for Flexible Electronic Encapsulation.ACS APPLIED MATERIALS & INTERFACES,11(19),17915-17924. |
| MLA | Yuan, Jie,et al."Highly Thermally Conducting Polymer-Based Films with Magnetic Field-Assisted Vertically Aligned Hexagonal Boron Nitride for Flexible Electronic Encapsulation".ACS APPLIED MATERIALS & INTERFACES 11.19(2019):17915-17924. |
入库方式： OAI收割
来源：金属研究所
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