Reliability issues of lead-free solder joints in electronic devices
文献类型：期刊论文
| 作者 | Jiang, Nan2; Zhang, Liang2,3; Liu, Zhi-Quan4; Sun, Lei1; Long, Wei-Min5; He, Peng3; Xiong, Ming-Yue2; Zhao, Meng2 |
| 刊名 | SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS
 |
| 出版日期 | 2019-12-31 |
| 卷号 | 20期号:1页码:876-901 |
| 关键词 | Lead-free solder reliability IMC crack failure |
| ISSN号 | 1468-6996 |
| DOI | 10.1080/14686996.2019.1640072 |
| 通讯作者 | Zhang, Liang(zhangliang@jsnu.edu.cn) |
| 英文摘要 | Electronic products are evolving towards miniaturization, high integration, and multi-function, which undoubtedly puts forward higher requirements for the reliability of solder joints in electronic packaging. Approximately 70% of failure in electronic devices originates during the packaging process, mostly due to the failure of solder joints. With the improvement of environmental protection awareness, lead-free solder joints have become a hot issue in recent years. This paper reviews the research progress on the reliability of lead-free solder joints and discusses the influence of temperature, vibration, tin whisker and electromigration on the reliability of solder joints. In addition, the measures to improve the reliability of solder joints are analyzed according to the problems of solder joints themselves, which provides a further theoretical basis for the study of the reliability of solder joints of electronic products in service. |
| 资助项目 | National Key R&D Program of China[2017YFB0305700] ; Key project of State Key Laboratory of Advanced Welding and Joining[AWJ-19Z04] ; Qing Lan Project ; Six talent peaks project in Jiangsu Province[XCL-022] ; Natural Science Foundation of China[51475220] ; [2015DFA50470] |
| WOS研究方向 | Materials Science |
| 语种 | 英语 |
| WOS记录号 | WOS:000483617100001 |
| 出版者 | TAYLOR & FRANCIS LTD |
| 资助机构 | National Key R&D Program of China ; Key project of State Key Laboratory of Advanced Welding and Joining ; Qing Lan Project ; Six talent peaks project in Jiangsu Province ; Natural Science Foundation of China |
| 源URL | [http://ir.imr.ac.cn/handle/321006/135405]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 通讯作者 | Zhang, Liang |
| 作者单位 | 1.Nanjing Univ Aeronaut & Astronaut, Natl Key Lab Sci & Technol Helicopter Transmiss, Nanjing, Jiangsu, Peoples R China 2.Jiangsu Normal Univ, Sch Mechatron Engn, Xuzhou 221116, Jiangsu, Peoples R China 3.Harbin Inst Technol, State Key Lab Adv Welding & Joining, Harbin, Heilongjiang, Peoples R China 4.Chinese Acad Sci, Inst Met Res, Shenyang, Liaoning, Peoples R China 5.Zhengzhou Res Inst Mech Engn, State Key Lab Adv Brazing Filler Met & Technol, Zhengzhou, Henan, Peoples R China |
| 推荐引用方式 GB/T 7714 | Jiang, Nan,Zhang, Liang,Liu, Zhi-Quan,et al. Reliability issues of lead-free solder joints in electronic devices[J]. SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS,2019,20(1):876-901. |
| APA | Jiang, Nan.,Zhang, Liang.,Liu, Zhi-Quan.,Sun, Lei.,Long, Wei-Min.,...&Zhao, Meng.(2019).Reliability issues of lead-free solder joints in electronic devices.SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS,20(1),876-901. |
| MLA | Jiang, Nan,et al."Reliability issues of lead-free solder joints in electronic devices".SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS 20.1(2019):876-901. |
入库方式： OAI收割
来源：金属研究所
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