Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method
文献类型：期刊论文
| 作者 | Jiang, Lin1,2; Zhang, Liang1,3; Liu, Zhi-Quan1,2 |
| 刊名 | ACTA METALLURGICA SINICA-ENGLISH LETTERS
 |
| 出版日期 | 2019-11-01 |
| 卷号 | 32期号:11页码:1407-1414 |
| 关键词 | Co target assembly Solder Residual stress Simulation Taguchi method Optimal design |
| ISSN号 | 1006-7191 |
| DOI | 10.1007/s40195-019-00875-6 |
| 通讯作者 | Liu, Zhi-Quan(zqliu@imr.ac.cn) |
| 英文摘要 | Target assembly is a key consumable material for producing thin film used in the electronic packaging and devices. The residual stresses induced during the process of soldering are detrimental to the performance of target assembly. In this work, the intensity and distribution of the soldering residual stress of Co/In/Cu target assembly subjected to a 20 W/(m(2) K) cooling condition corresponding to the actual air cooling process were studied, based on finite element simulation and Taguchi method, to optimize the sputtering target assembly. Effects of different control factors, including solder material, thickness of solder layer, target and backing plate, on the soldering residual stress of target assembly are investigated. The maximum residual stress is calculated as 9.28 MPa in the target located at 0.16 mm from target-solder layer interface and at a distance of 0.78 mm from symmetry axis. The optimal design in target assembly has the combination of indium solder material, cobalt target at 12 mm thick, solder layer at 0.8 mm thick, copper backing plate at 15 mm thick. Moreover, solder material is the most important factor among control factors in the target assembly. |
| 资助项目 | National Key R&D Program of China[2017YFB0305501] ; National Natural Science Foundation of China[51475220] ; China Postdoctoral Science Foundation[2016M591464] |
| WOS研究方向 | Metallurgy & Metallurgical Engineering |
| 语种 | 英语 |
| WOS记录号 | WOS:000488930700011 |
| 出版者 | CHINESE ACAD SCIENCES, INST METAL RESEARCH |
| 资助机构 | National Key R&D Program of China ; National Natural Science Foundation of China ; China Postdoctoral Science Foundation |
| 源URL | [http://ir.imr.ac.cn/handle/321006/135803]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 通讯作者 | Liu, Zhi-Quan |
| 作者单位 | 1.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China 2.Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 11016, Liaoning, Peoples R China 3.Jiangsu Normal Univ, Sch Mechatron Engn, Xuzhou 221116, Jiangsu, Peoples R China |
| 推荐引用方式 GB/T 7714 | Jiang, Lin,Zhang, Liang,Liu, Zhi-Quan. Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method[J]. ACTA METALLURGICA SINICA-ENGLISH LETTERS,2019,32(11):1407-1414. |
| APA | Jiang, Lin,Zhang, Liang,&Liu, Zhi-Quan.(2019).Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method.ACTA METALLURGICA SINICA-ENGLISH LETTERS,32(11),1407-1414. |
| MLA | Jiang, Lin,et al."Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method".ACTA METALLURGICA SINICA-ENGLISH LETTERS 32.11(2019):1407-1414. |
入库方式： OAI收割
来源：金属研究所
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