The mechanism of Pd distribution in the process of FAB formation during Pd-coated Cu wire bonding
文献类型：期刊论文
| 作者 | Du, Yahong1,2; Liu, Zhi-Quan1,2; Ji, Hongjun3; Li, Mingyu3; Wen, Ming4 |
| 刊名 | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
 |
| 出版日期 | 2018-08-01 |
| 卷号 | 29期号:16页码:13774-13781 |
| ISSN号 | 0957-4522 |
| DOI | 10.1007/s10854-018-9508-z |
| 通讯作者 | Liu, Zhi-Quan(zqliu@imr.ac.cn) ; Wen, Ming(wen@ipm.com.cn) |
| 英文摘要 | The palladium (Pd) distribution over the free air ball (FAB) and its effect on the ball's shear strength were investigated in the Pd-coated copper (Cu) wire bonding process. It was found that for the same FAB/wire diameter ratio of 1.5, the bigger the electrical flame-off (EFO) current was, the larger would be the exposed Cu regions over FAB without Pd distribution. Combining experimental observations, a model of Pd distribution over FAB was first proposed by changing the EFO current and firing time. As the firing time increased, the coated Pd element could be dissolved into the Cu base to form a PdCu alloy at the FAB surface, to protect the bonded ball from corrosion. The Pd-coated Cu wire has higher bonding shear strength than the bare Cu wire. However, the FAB with the largest Pd coverage had the smallest ball shear strength, which revealed that the control of Pd distribution over FAB is very critical for a high-quality bonding interface. |
| 资助项目 | National Key R&D Program of China[2017YFB0305700] ; National Natural Science Foundation of China[51564025] ; State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals[SKL-SPM-201803] |
| WOS研究方向 | Engineering ; Materials Science ; Physics |
| 语种 | 英语 |
| WOS记录号 | WOS:000439338500038 |
| 出版者 | SPRINGER |
| 资助机构 | National Key R&D Program of China ; National Natural Science Foundation of China ; State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals |
| 源URL | [http://ir.imr.ac.cn/handle/321006/135905]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 通讯作者 | Liu, Zhi-Quan; Wen, Ming |
| 作者单位 | 1.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China 2.Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Liaoning, Peoples R China 3.Harbin Inst Technol Shenzhen, State Key Lab Adv Welding & Joining, Shenzhen 518055, Peoples R China 4.Kunming Inst Precious Met, Kunming 650106, Yunnan, Peoples R China |
| 推荐引用方式 GB/T 7714 | Du, Yahong,Liu, Zhi-Quan,Ji, Hongjun,et al. The mechanism of Pd distribution in the process of FAB formation during Pd-coated Cu wire bonding[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(16):13774-13781. |
| APA | Du, Yahong,Liu, Zhi-Quan,Ji, Hongjun,Li, Mingyu,&Wen, Ming.(2018).The mechanism of Pd distribution in the process of FAB formation during Pd-coated Cu wire bonding.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,29(16),13774-13781. |
| MLA | Du, Yahong,et al."The mechanism of Pd distribution in the process of FAB formation during Pd-coated Cu wire bonding".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 29.16(2018):13774-13781. |
入库方式： OAI收割
来源：金属研究所
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