Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder
文献类型：期刊论文
| 作者 | Cao Lihua2; Chen Yinbo2,3; Shi Qiyuan2; Yuan Jie2,3; Liu Zhiquan1,2,3 |
| 刊名 | ACTA METALLURGICA SINICA
 |
| 出版日期 | 2019-12-11 |
| 卷号 | 55期号:12页码:1606-1614 |
| ISSN号 | 0412-1961 |
| 关键词 | alloy element Sn-Ag-Cu solder intermetallic compound interfacial morphology shear strength |
| DOI | 10.11900/0412.1961.2019.00033 |
| 通讯作者 | Liu Zhiquan(zqliu@siat.ac.cn) |
| 英文摘要 | The eutectic Sn-Ag-Cu (SAC) alloy is the most widely used solder alloy in consuming electronic devices owing to its good wettability and mechanical properties. However, the growth of automotive electronics working at a higher temperature than consuming electronics, requires more reliable solder alloy during microelectronic packaging, which can be achieved by elemental alloying. In this work, the modified Sn-Ag-Cu alloy with Ni, Sb and Bi addition was soldered on the surface of NiSn, NiAu and NiPdAu coating layer respectively, and the effects of elemental addition on the interfacial microstructure and shear strength were investigated systematically. It was found that compared to the commercial SAC305 solder joint, the modified Sn-Ag-Cu solder joint has a thinner interfacial IMC layer while a higher shear strength under the same reflowing conditions, although the formed IMC species are all (Cu, Ni)(6)Sn-5 at both the chip side and the printed circuit board (PCB) sides. The addition of Ni, Sb and Au elements can reduce the IMC growth rate, while the addition of Pd increases the IMC growth. For the same solder alloy and reflowing process, the thickness of IMC layer on NiPdAu is the largest, while that on NiAu coating layer is the smallest. Au or Pd addition in the coating layer affects the distribution of Ag3Sn from dispersive particles to net-like morphology, resulting in an improvement of solder shear strength. The addition of Ag and Cu elements can increase the volume proportion of (Cu, Ni)(6)Sn-5 and Ag3Sn in the solder alloy, hence to increase the shear strength of the solder joints. The solution and precipitation of Bi in the solder alloy can also contribute to the higher shear strength of the modified Sn-Ag-Cu solder joint, although its melting point is decreased to about 213 degrees C. Therefore, the shear strength of modified solder alloy with Ni, Sb and Bi elements is higher than that of commercial SAC305. |
| 资助项目 | National Key Research and Development Program of China[2017YFB0305700] |
| WOS研究方向 | Metallurgy & Metallurgical Engineering |
| 语种 | 英语 |
| 出版者 | SCIENCE PRESS |
| WOS记录号 | WOS:000497774900014 |
| 资助机构 | National Key Research and Development Program of China |
| 源URL | [http://ir.imr.ac.cn/handle/321006/136129]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 通讯作者 | Liu Zhiquan |
| 作者单位 | 1.Chinese Acad Sci, Shenzhen Inst Adv Technol, Shenzhen 518055, Guangdong, Peoples R China 2.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China 3.Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Liaoning, Peoples R China |
| 推荐引用方式 GB/T 7714 | Cao Lihua,Chen Yinbo,Shi Qiyuan,et al. Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder[J]. ACTA METALLURGICA SINICA,2019,55(12):1606-1614. |
| APA | Cao Lihua,Chen Yinbo,Shi Qiyuan,Yuan Jie,&Liu Zhiquan.(2019).Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder.ACTA METALLURGICA SINICA,55(12),1606-1614. |
| MLA | Cao Lihua,et al."Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder".ACTA METALLURGICA SINICA 55.12(2019):1606-1614. |
入库方式： OAI收割
来源：金属研究所
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