Highly solderability of FeP film in contact with SnAgCu solder
文献类型：期刊论文
| 作者 | Zhou, Haifei1; Guo, Jingdong2; Shang, Jianku3; Song, Xiaoning1 |
| 刊名 | JOURNAL OF ALLOYS AND COMPOUNDS
 |
| 出版日期 | 2020-03-25 |
| 卷号 | 818页码:6 |
| 关键词 | Solderability Electroless FeP SnAgCu Oxidation |
| ISSN号 | 0925-8388 |
| DOI | 10.1016/j.jallcom.2019.152900 |
| 通讯作者 | Guo, Jingdong(jdguo@imr.ac.cn) ; Shang, Jianku(jkshang@illinois.edu) |
| 英文摘要 | New under bump metallization (UBM) is required for future microelectronics to minimize reliability concerns with solder interconnects. In this study, electroless FeP film was prepared as UBM. Solderability of electroless NiP, electrodeposite Fe and electroless FeP films with eutectic SnAgCu solder was investigated by static wetting tests and wetting balance measurements. Results revealed that the solderability of NiP film has almost no change with thermal aged for the film in air atmosphere increasing. The contact angles for FeP and Fe films with SnAgCu solder increased and the maximum wetting force decreased with heating time increasing from 0 h, 48 h, 89 h-160 h at 180 degrees C. But the solderability of FeP film was found to be better than those of NiP and Fe whether the films in base or thermal aged at 180 degrees C for 89 h. Even after thermal aged in air atmosphere at 180 degrees C for 160 h, the FeP also performed the smallest contace angle compared with the NiP and the Fe. Oxide layer on the surface of FeP was much easier to be removed by rosin mildly activated flux during reflow process because loose structure. It was proved to be the key for the highly solderability of electroless FeP. (C) 2019 Elsevier B.V. All rights reserved. |
| 资助项目 | State Grid Scientific and Technological Research Program of China[5211DS17001X] |
| WOS研究方向 | Chemistry ; Materials Science ; Metallurgy & Metallurgical Engineering |
| 语种 | 英语 |
| WOS记录号 | WOS:000506166900072 |
| 出版者 | ELSEVIER SCIENCE SA |
| 资助机构 | State Grid Scientific and Technological Research Program of China |
| 源URL | [http://ir.imr.ac.cn/handle/321006/136329]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 通讯作者 | Guo, Jingdong; Shang, Jianku |
| 作者单位 | 1.Zhejiang Elect Power Corp Res Inst, Hangzhou 310014, Peoples R China 2.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China 3.Univ Illinois, Dept Mat Sci & Engn, Urbana, IL 61801 USA |
| 推荐引用方式 GB/T 7714 | Zhou, Haifei,Guo, Jingdong,Shang, Jianku,et al. Highly solderability of FeP film in contact with SnAgCu solder[J]. JOURNAL OF ALLOYS AND COMPOUNDS,2020,818:6. |
| APA | Zhou, Haifei,Guo, Jingdong,Shang, Jianku,&Song, Xiaoning.(2020).Highly solderability of FeP film in contact with SnAgCu solder.JOURNAL OF ALLOYS AND COMPOUNDS,818,6. |
| MLA | Zhou, Haifei,et al."Highly solderability of FeP film in contact with SnAgCu solder".JOURNAL OF ALLOYS AND COMPOUNDS 818(2020):6. |
入库方式： OAI收割
来源：金属研究所
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