Gradient growth of fcc and bcc phase within FexNi1-x (50 < x < 75) films during direct-current wafer electroplating
文献类型：期刊论文
| 作者 | Gao, Li-Yin1,2; Wan, Peng1; Liu, Zhi-Quan1,2 |
| 刊名 | JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS
 |
| 出版日期 | 2020-03-15 |
| 卷号 | 498页码:6 |
| 关键词 | Fe-Ni Electrodeposition Transmission electron microscopy (TEM) Interfacial structure |
| ISSN号 | 0304-8853 |
| DOI | 10.1016/j.jmmm.2019.166131 |
| 通讯作者 | Liu, Zhi-Quan(zqliu@siat.ac.cn) |
| 英文摘要 | In order to investigate the performance of Fe-Ni magnetic cores within embedded inductor in 3D package, a series of Fe-Ni films with compositions ranging from 15 wt% to 80 wt% iron were electrodeposited on 8-inch silicon wafer. The uniformity on brightness, phase structure and grain size of Fe-Ni magnetic films were investigated through SEM (scanning electron microscopy) and XRD (X-ray diffraction). A gradient growth behavior of fcc (face-centered cubic) and bcc (body-centered cubic) phase was revealed when Fe content ranges 50-75 wt % within Fe-Ni films, which can be attributed to the slightly faster growth rate of fcc phase. As also revealed in TEM (transmission electron microscope) observation, the fcc phase gradually spread over bcc phase region during the electroplating process, and formed an interface with a slight tilt angle to the substrate on the thickness direction. Several methods, such as increasing solution stirring, temperature or decreasing the current density, were proposed to restrain the gradient growth behavior of Fe-Ni film in wafer level. |
| 资助项目 | Major National Science and Technology Program of China[2011ZX02602] ; National and Local Joint Engineering Laboratory of Advanced Electronic Packaging Materials (Shenzhen Development and Reform Commission)[2017-934] |
| WOS研究方向 | Materials Science ; Physics |
| 语种 | 英语 |
| WOS记录号 | WOS:000504845300064 |
| 出版者 | ELSEVIER |
| 资助机构 | Major National Science and Technology Program of China ; National and Local Joint Engineering Laboratory of Advanced Electronic Packaging Materials (Shenzhen Development and Reform Commission) |
| 源URL | [http://ir.imr.ac.cn/handle/321006/136539]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 通讯作者 | Liu, Zhi-Quan |
| 作者单位 | 1.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China 2.Chinese Acad Sci, Shenzhen Inst Adv Technol, Shenzhen Inst Adv Elect Mat, Shenzhen 518055, Guangdong, Peoples R China |
| 推荐引用方式 GB/T 7714 | Gao, Li-Yin,Wan, Peng,Liu, Zhi-Quan. Gradient growth of fcc and bcc phase within FexNi1-x (50 < x < 75) films during direct-current wafer electroplating[J]. JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS,2020,498:6. |
| APA | Gao, Li-Yin,Wan, Peng,&Liu, Zhi-Quan.(2020).Gradient growth of fcc and bcc phase within FexNi1-x (50 < x < 75) films during direct-current wafer electroplating.JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS,498,6. |
| MLA | Gao, Li-Yin,et al."Gradient growth of fcc and bcc phase within FexNi1-x (50 < x < 75) films during direct-current wafer electroplating".JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS 498(2020):6. |
入库方式： OAI收割
来源：金属研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。