Electrical/thermal behaviors of bimetallic (Ag-Cu, Ag-Sn) nanoparticles for printed electronics
文献类型：期刊论文
| 作者 | Wang, Xin1; Huang, Feirong1; Wang, Dongxing4; Li, Da3; Li, Pu2; Muhammad, Javid1; Dong, Xinglong1; Zhang, Zhidong3 |
| 刊名 | NANOTECHNOLOGY
 |
| 出版日期 | 2020-03-27 |
| 卷号 | 31期号:13页码:9 |
| 关键词 | DC arc-discharge method bimetallic nanoparticles printed electronics thermal stability resistivity |
| ISSN号 | 0957-4484 |
| DOI | 10.1088/1361-6528/ab5fed |
| 通讯作者 | Dong, Xinglong(dongxl@dlut.edu.cn) |
| 英文摘要 | In this work, Ag-Cu and Ag-Sn nanoparticles (NPs) were synthesized by a physical vapor condensation method, i.e. DC arc-discharge plasma. The as-prepared bimetallic NPs consist of metallic cores of Ag-Cu or Ag-Sn and ultrathin oxide shells of CuO or a hybrid of SnO and SnO2. Ag-Sn NPs exhibit a room-temperature resistivity of 4.24 x 10(-5) omega cm, a little lower than 7.10 x 10(-5) omega cm of Ag-Cu NPs. Both bimetallic NPs demonstrate typical metallic conduction behavior with a positive temperature coefficient of resistance over 25-300 K. Ag-Sn NPs exhibit thermally competitive stability up to 230 degrees C and a lower resistivity of 3.18 x 10(-5) omega cm after sintering at 200 degrees C, giving it potential for application in flexible printed electronics. |
| 资助项目 | National Natural Science Foundation of China[51331006] ; National Natural Science Foundation of China[51271044] |
| WOS研究方向 | Science & Technology - Other Topics ; Materials Science ; Physics |
| 语种 | 英语 |
| WOS记录号 | WOS:000520169000001 |
| 出版者 | IOP PUBLISHING LTD |
| 资助机构 | National Natural Science Foundation of China |
| 源URL | [http://ir.imr.ac.cn/handle/321006/137634]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 通讯作者 | Dong, Xinglong |
| 作者单位 | 1.Dalian Univ Technol, Sch Mat Sci & Engn, Key Lab Mat Modificat Laser Ion & Elect Beams, Minist Educ, Dalian 116023, Peoples R China 2.China United Test & Certificat Co LTD, Gen Res Inst Nonferrous Met, Beijing 100088, Peoples R China 3.Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Int Ctr Mat Phys, Shenyang 110016, Peoples R China 4.Ningbo Univ Technol, Inst Mat, Ningbo 315016, Peoples R China |
| 推荐引用方式 GB/T 7714 | Wang, Xin,Huang, Feirong,Wang, Dongxing,et al. Electrical/thermal behaviors of bimetallic (Ag-Cu, Ag-Sn) nanoparticles for printed electronics[J]. NANOTECHNOLOGY,2020,31(13):9. |
| APA | Wang, Xin.,Huang, Feirong.,Wang, Dongxing.,Li, Da.,Li, Pu.,...&Zhang, Zhidong.(2020).Electrical/thermal behaviors of bimetallic (Ag-Cu, Ag-Sn) nanoparticles for printed electronics.NANOTECHNOLOGY,31(13),9. |
| MLA | Wang, Xin,et al."Electrical/thermal behaviors of bimetallic (Ag-Cu, Ag-Sn) nanoparticles for printed electronics".NANOTECHNOLOGY 31.13(2020):9. |
入库方式： OAI收割
来源：金属研究所
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