Microstructure formation and electrical resistivity behavior of rapidly solidified Cu-Fe-Zr immiscible alloys
文献类型：期刊论文
| 作者 | Sun, Xiaojun1,2; He, Jie1,2; Chen, Bin1,2; Zhang, Lili1; Jiang, Hongxiang1; Zhao, Jiuzhou1,2; Hao, Hongri1 |
| 刊名 | JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
 |
| 出版日期 | 2020-05-01 |
| 卷号 | 44页码:201-208 |
| 关键词 | Immiscible alloys Liquid-liquid phase separation Rapid solidification Microstructure Electrical resistivity behavior |
| ISSN号 | 1005-0302 |
| DOI | 10.1016/j.jmst.2019.10.038 |
| 通讯作者 | He, Jie(jiehe@imr.ac.cn) |
| 英文摘要 | The immiscible Cu-Fe alloy was characterized by a metastable miscibility gap. With the addition element Zr, the miscibility gap can be extended into the Cu-Fe-Zr ternary system. The effect of the atomic ratio of Cu to Fe and Zr content on the behavior of liquid-liquid phase separation was studied. The results show that liquid-liquid phase separation into Cu-rich and Fe-rich liquids took place in the as-quenched Cu-Fe-Zr alloy. A glassy structure with nanoscale phase separation was obtained in the as-quenched (Cu0.5Fe0.5)(40)Zr-60 alloy sample, exhibiting a homogeneous distribution of glassy Cu-rich nanoparticles in glassy Fe-rich matrix. The microstructural evolution and the competitive mechanism of phase formation in the rapidly solidified Cu-Fe-Zr system were discussed in detail. Moreover, the electrical property of the as-quenched Cu-Fe-Zr alloy samples was examined. It displays an abnormal change of electrical resistivity upon temperature in the nanoscale-phase-separation metallic glass. The crystallization behavior of such metallic glass has been discussed. (C) 2020 Published by Elsevier Ltd on behalf of The editorial office of Journal of Materials Science & Technology. |
| 资助项目 | National Natural Science Foundation of China[51774264] ; National Natural Science Foundation of China[51574216] ; National Natural Science Foundation of China[51974288] ; National Natural Science Foundation of China[51374194] ; Natural Science Foundation of Liaoning Province of China[2019-MS-332] |
| WOS研究方向 | Materials Science ; Metallurgy & Metallurgical Engineering |
| 语种 | 英语 |
| WOS记录号 | WOS:000522863000021 |
| 出版者 | JOURNAL MATER SCI TECHNOL |
| 资助机构 | National Natural Science Foundation of China ; Natural Science Foundation of Liaoning Province of China |
| 源URL | [http://ir.imr.ac.cn/handle/321006/137843]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 通讯作者 | He, Jie |
| 作者单位 | 1.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China 2.Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Peoples R China |
| 推荐引用方式 GB/T 7714 | Sun, Xiaojun,He, Jie,Chen, Bin,et al. Microstructure formation and electrical resistivity behavior of rapidly solidified Cu-Fe-Zr immiscible alloys[J]. JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,2020,44:201-208. |
| APA | Sun, Xiaojun.,He, Jie.,Chen, Bin.,Zhang, Lili.,Jiang, Hongxiang.,...&Hao, Hongri.(2020).Microstructure formation and electrical resistivity behavior of rapidly solidified Cu-Fe-Zr immiscible alloys.JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,44,201-208. |
| MLA | Sun, Xiaojun,et al."Microstructure formation and electrical resistivity behavior of rapidly solidified Cu-Fe-Zr immiscible alloys".JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY 44(2020):201-208. |
入库方式： OAI收割
来源：金属研究所
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