中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Synthesis of Sn nanowire by template electrodeposition and its conversion into Sn nanosolder

文献类型:期刊论文

作者Meng, Zhi-Chao1,3; Gao, Li-Yin2; Liu, Zhi-Quan1,2,3
刊名MATERIALS CHARACTERIZATION
出版日期2020-05-01
卷号163页码:9
ISSN号1044-5803
关键词Sn nanowire Template electrodeposition Microstructural characterization Liquid bath melting Lead-free solder Melting point
DOI10.1016/j.matchar.2020.110278
通讯作者Liu, Zhi-Quan(zqliu@siat.ac.cn)
英文摘要Electrodeposition of Sn within porous anodic aluminum oxide (AAO) template was used to synthesize Sn nanowires. Ag seed layer was sputtered upon AAO template firstly, then the Sn nanowires were electroplated upon the seed layer. After electrodeposition the Ag seed layer was removed and the AAO template was dissolved in order to obtain Sn nanowires finally. The diameter of Sn nanowires was about 200 nm, being consistent with the template pore size, while the length of nanowires had a linear growth rate of approximately 2.49 mu m/min. X-ray diffraction (XRD) and electron diffraction revealed that individual Sn nanowire was single crystal without preferential growth direction. The surface of the nanowire was wrapped by a thin SnO film (similar to 5 nm thick), as verified by transmission electron microscopy (TEM) observation and X-ray photoelectron spectrometer (XPS) analyses. The synthesized Sn nanowire powders had a dark brown color, which comes from the surface SnO layer. Through the differential scanning calorimetry (DSC) analysis, the melting point of Sn nanowires was determined as 231.73 degrees C, which is about 2.7% lower than the pure Sn particles. Fabrication of Sn nanosolders from Sn nanowires was tried using liquid bath melting method. It was found that Sn nanowires could convert into spheroidal nanosolder in liquid paraffin, which demonstrated a novel technology to fabricate nanosolders used for nanoscale interconnections.
资助项目National Key Research and Development Program of China[2017YFB0305700] ; National and Local Joint Engineering Laboratory of Advanced Electronic Packaging Materials (Shenzhen Development and Reform Commission)[2017-934]
WOS研究方向Materials Science ; Metallurgy & Metallurgical Engineering
语种英语
出版者ELSEVIER SCIENCE INC
WOS记录号WOS:000551341700050
资助机构National Key Research and Development Program of China ; National and Local Joint Engineering Laboratory of Advanced Electronic Packaging Materials (Shenzhen Development and Reform Commission)
源URL[http://ir.imr.ac.cn/handle/321006/139912]  
专题金属研究所_中国科学院金属研究所
通讯作者Liu, Zhi-Quan
作者单位1.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China
2.Chinese Acad Sci, Shenzhen Inst Adv Elect Mat, Shenzhen Inst Adv Technol, Shenzhen 518055, Peoples R China
3.Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Peoples R China
推荐引用方式
GB/T 7714
Meng, Zhi-Chao,Gao, Li-Yin,Liu, Zhi-Quan. Synthesis of Sn nanowire by template electrodeposition and its conversion into Sn nanosolder[J]. MATERIALS CHARACTERIZATION,2020,163:9.
APA Meng, Zhi-Chao,Gao, Li-Yin,&Liu, Zhi-Quan.(2020).Synthesis of Sn nanowire by template electrodeposition and its conversion into Sn nanosolder.MATERIALS CHARACTERIZATION,163,9.
MLA Meng, Zhi-Chao,et al."Synthesis of Sn nanowire by template electrodeposition and its conversion into Sn nanosolder".MATERIALS CHARACTERIZATION 163(2020):9.

入库方式: OAI收割

来源:金属研究所

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