Role of Cu/graphene interface in suppressing fatigue damage of submicron Cu films for flexible electronics
文献类型：期刊论文
| 作者 | Yang, Yu-Jia1; Zhang, Bin1; Wan, Hong-Yuan2,3; Zhang, Guang-Ping3 |
| 刊名 | MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
 |
| 出版日期 | 2020-08-05 |
| 卷号 | 792页码:10 |
| 关键词 | Cu Graphene Interface Fatigue extrusions Voids |
| ISSN号 | 0921-5093 |
| DOI | 10.1016/j.msea.2020.139786 |
| 通讯作者 | Zhang, Bin(zhangb@atm.neu.edu.cn) ; Zhang, Guang-Ping(gpzhang@imr.ac.cn) |
| 英文摘要 | To enhance the mechanical reliability without sacrificing the electrical conductivity of the flexible electronics, in this work submicmn-thick Cu/Au/PI (CAP) and graphene/Cu/Au/PI (GCAP) films were fabricated successfully by using a series of assembly methods through introducing a graphene passivation layer onto the polyimide (PI)-supported Cu film surface, and a nanoscale gold (Au) interlayer between the Cu/PI interface. Tensile testing results reveal that the yield strength, the fracture strain and the electrical properties of the GCAP film were improved simultaneously. Furthermore, the GCAP film also exhibited a higher fatigue strength than the CAP film. The basic mechanism is mainly attributed to the effective suppression of the Cu/graphene interface on the fatigue extrusion formation through constraining dislocation motion. |
| 资助项目 | National Natural Science Foundation of China (NSFC)[51671050] ; National Natural Science Foundation of China (NSFC)[51971060] |
| WOS研究方向 | Science & Technology - Other Topics ; Materials Science ; Metallurgy & Metallurgical Engineering |
| 语种 | 英语 |
| WOS记录号 | WOS:000553980500026 |
| 出版者 | ELSEVIER SCIENCE SA |
| 资助机构 | National Natural Science Foundation of China (NSFC) |
| 源URL | [http://ir.imr.ac.cn/handle/321006/140020]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 通讯作者 | Zhang, Bin; Zhang, Guang-Ping |
| 作者单位 | 1.Northeastern Univ, Sch Mat Sci & Engn, Key Lab Anisotropy & Texture Mat, Minist Educ, 3-11 Wenhua Rd, Shenyang 110819, Peoples R China 2.Univ Sci & Technol China, Sch Mat Sci & Engn, 72 Wenhua Rd, Shenyang 110016, Peoples R China 3.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, 72 Wenhua Rd, Shenyang 110016, Peoples R China |
| 推荐引用方式 GB/T 7714 | Yang, Yu-Jia,Zhang, Bin,Wan, Hong-Yuan,et al. Role of Cu/graphene interface in suppressing fatigue damage of submicron Cu films for flexible electronics[J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,2020,792:10. |
| APA | Yang, Yu-Jia,Zhang, Bin,Wan, Hong-Yuan,&Zhang, Guang-Ping.(2020).Role of Cu/graphene interface in suppressing fatigue damage of submicron Cu films for flexible electronics.MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,792,10. |
| MLA | Yang, Yu-Jia,et al."Role of Cu/graphene interface in suppressing fatigue damage of submicron Cu films for flexible electronics".MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 792(2020):10. |
入库方式： OAI收割
来源：金属研究所
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