Influences of Ag and In Alloying on Microstructure and Mechanical Properties of Sn-58Bi Solder
文献类型：期刊论文
| 作者 | Yang, Jie1,2; Zhang, Qingke2; Song, Zhenlun2 |
| 刊名 | JOURNAL OF ELECTRONIC MATERIALS
 |
| 出版日期 | 2020-11-12 |
| 页码 | 8 |
| ISSN号 | 0361-5235 |
| 关键词 | SnBi solder Ag and In addition microhardness nano-indentation impact toughness fracture mechanism |
| DOI | 10.1007/s11664-020-08595-9 |
| 通讯作者 | Zhang, Qingke(zhangqingke@nimte.ac.cn) |
| 英文摘要 | Ag (2.0 wt.%) and In (1.5 wt.%) were alloyed into Sn-58Bi eutectic solder, and the individual and combined influences of Ag and In on the microstructure, microhardness, and impact toughness of the SnBi solder were investigated. The results reveal that the microstructures of the SnBiAg, SnBiIn, and SnBiAgIn alloyed solders are coarser than that of the SnBi eutectic solder. Fine Ag3Sn particles are formed in the SnBiAg and SnBiAgIn solders, while small regions of In-rich phases appear in the SnBiIn and SnBiAgIn solders. The microhardness of the three alloyed solders are higher than the SnBi solder, and the Sn-rich phases in the alloyed solders show higher nanohardness, while the nanohardness of the Bi-rich phases with Ag and In addition changes little. The impact toughness of the SnBiAg, SnBiIn, and SnBiAgIn solders are observed to be higher than the SnBi solder, especially in the case of the SnBiAgIn solder. The improvement in ductility of the Sn-rich phase induced by the In solution, and the strengthening effect from the Ag3Sn particles are predicated to be the reason for the increase in impact toughness. The fracture surfaces demonstrate that plastic deformation of the SnBiAgIn solder during the impact process is more obvious. Overall, the combined addition of Ag and In can increase the microhardness and impact toughness of SnBi eutectic solder. |
| 资助项目 | Natural Science Foundation of Zhejiang Province[LQ20E050005] ; National Natural Science Foundation of China[52001317] |
| WOS研究方向 | Engineering ; Materials Science ; Physics |
| 语种 | 英语 |
| 出版者 | SPRINGER |
| WOS记录号 | WOS:000588852800001 |
| 资助机构 | Natural Science Foundation of Zhejiang Province ; National Natural Science Foundation of China |
| 源URL | [http://ir.imr.ac.cn/handle/321006/141338]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 通讯作者 | Zhang, Qingke |
| 作者单位 | 1.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China 2.Chinese Acad Sci, Ningbo Inst Mat Technol & Engn, Key Lab Marine Mat & Related Technol, Zhejiang Key Lab Marine Mat & Protect Technol, Ningbo 315201, Peoples R China |
| 推荐引用方式 GB/T 7714 | Yang, Jie,Zhang, Qingke,Song, Zhenlun. Influences of Ag and In Alloying on Microstructure and Mechanical Properties of Sn-58Bi Solder[J]. JOURNAL OF ELECTRONIC MATERIALS,2020:8. |
| APA | Yang, Jie,Zhang, Qingke,&Song, Zhenlun.(2020).Influences of Ag and In Alloying on Microstructure and Mechanical Properties of Sn-58Bi Solder.JOURNAL OF ELECTRONIC MATERIALS,8. |
| MLA | Yang, Jie,et al."Influences of Ag and In Alloying on Microstructure and Mechanical Properties of Sn-58Bi Solder".JOURNAL OF ELECTRONIC MATERIALS (2020):8. |
入库方式： OAI收割
来源：金属研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。