Dalian
文献类型：期刊论文
| 作者 | Wei WANG; Zhongguang WANG; Aiping XIAN; Jianku SHANG |
| 刊名 | Journal of Materials Science & Technology
 |
| 出版日期 | 2007 |
| 卷号 | 23期号:1页码:85-91 |
| 关键词 | CBGA Thermal cycling FEM Assembly Cracking |
| ISSN号 | 1005-0302 |
| 其他题名 | Dalian |
| 英文摘要 | Two kinds of CBGA (ceramic ball grid array) assemblies were made by reflow soldering process using two different Pb-free solders. Microstructural evolution and cracks induced by thermal cycling in CBGA assemblies were examined by scanning electron microscopy (SEM) and finite element method (FEM). Before thermal cycling, intermetallic compounds (IMCs) Cu6Sn5 and Ag3Sn were observed at the solder interface between Cu and Ag metallizations, respectively. After thermal cycling, another IMC Cu3Sn was observed near the Cu pad in both two assemblies and the layers of Cu6Sn5 and Ag3Sn became thicker. As a result of thermal cycling,cyclic stress and strain were accumulated in the solder joint leading to fatigue cracking. Both experiments and FEM revealed that cracks preferred to initiate at the corner of each solder joint. Multi-modes of the crack propagation were found in the two assemblies. Based on Coffin-Manson equation, the thermal fatigue life was calculated and the predicted life showed good agreement with the experimental results. |
| 语种 | 英语 |
| CSCD记录号 | CSCD:3192610 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/143230]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 作者单位 | 中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | Wei WANG,Zhongguang WANG,Aiping XIAN,et al. Dalian[J]. Journal of Materials Science & Technology,2007,23(1):85-91. |
| APA | Wei WANG,Zhongguang WANG,Aiping XIAN,&Jianku SHANG.(2007).Dalian.Journal of Materials Science & Technology,23(1),85-91. |
| MLA | Wei WANG,et al."Dalian".Journal of Materials Science & Technology 23.1(2007):85-91. |
入库方式： OAI收割
来源：金属研究所
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