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Effect of High Magnetic Field on Growth Behavior of Compound Layers during Reactive Diffusion between Solid Cu and Liquid Al

文献类型:期刊论文

作者Xu B; Tong W P; Liu C Z; Zhang H; Zuo L; He J C
刊名JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
出版日期2011
卷号27期号:9页码:856-860
关键词CARBON NI-63 Diffusion Activation energy High magnetic field Al Cu
ISSN号1005-0302
其他题名Effect of High Magnetic Field on Growth Behavior of Compound Layers during Reactive Diffusion between Solid Cu and Liquid Al
英文摘要The effect of magnetic field on the growth behavior of compound layer was examined at the interface between the solid Cu and liquid Al during reactive diffusion. It was found that the thickness of compound layer was reduced by the high magnetic field. The growth activation energy in beta, gamma(1) and epsilon(2) layers under a high magnetic field was larger than those in non magnetic circumstances, the increment percentage being 4.8%, 13.3% and 5.5%, respectively.
资助项目[National Natural Science Foundation of China] ; [111 Project] ; [Foundation for the Author of National Excellent Doctoral Dissertation of China] ; [Program for New Century Excellent Talents in University] ; [Fundamental Research Funds for the Central Universities]
语种英语
CSCD记录号CSCD:4410871
源URL[http://ir.imr.ac.cn/handle/321006/150019]  
专题金属研究所_中国科学院金属研究所
作者单位中国科学院金属研究所
推荐引用方式
GB/T 7714
Xu B,Tong W P,Liu C Z,et al. Effect of High Magnetic Field on Growth Behavior of Compound Layers during Reactive Diffusion between Solid Cu and Liquid Al[J]. JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,2011,27(9):856-860.
APA Xu B,Tong W P,Liu C Z,Zhang H,Zuo L,&He J C.(2011).Effect of High Magnetic Field on Growth Behavior of Compound Layers during Reactive Diffusion between Solid Cu and Liquid Al.JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,27(9),856-860.
MLA Xu B,et al."Effect of High Magnetic Field on Growth Behavior of Compound Layers during Reactive Diffusion between Solid Cu and Liquid Al".JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY 27.9(2011):856-860.

入库方式: OAI收割

来源:金属研究所

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