Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect
文献类型：期刊论文
| 作者 | Kang T Y2; Xiu Y Y1; Hui L1; Wang J J1; Tong W P2; Liu C Z1 |
| 刊名 | JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
 |
| 出版日期 | 2011 |
| 卷号 | 27期号:8页码:741-745 |
| 关键词 | SN-AG CU SUBSTRATE INTERFACIAL REACTIONS MICROSTRUCTURE COPPER BI TEMPERATURE STRENGTH ALLOYS JOINTS Solder Interfacial reaction Intermetallics Kinetics |
| ISSN号 | 1005-0302 |
| 其他题名 | Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect |
| 英文摘要 | The intermetallic compound (IMC) growth kinetics in pure Sn/Cu and Sn10 wt%Bi/Cu solder joints was studied, respectively, after they were aged at 160-210 degrees C for different time. It was found that the total IMC in Sn10 wt%Bi/Cu joint developed faster than it did in pure Sn/Cu solder joint, when they were aged at the same temperature. And the activation energy Q(a) for total IMC in Sn10 wt%Bi/Cu joint was lower than that for pure Sn/Cu interconnect. The IMC growth process was discussed. The IMC Cu6Sn5 was enhanced in compensation of reduced IMC Cu3Sn growth. The work reveals that Bi element containing in lead free solder alloys with 10 wt% can enhance IMC growth in lead free solder/Cu joint during service. |
| 资助项目 | [National Natural Science Foundation of China] ; [111 Project] ; [Foundation of National Excellent Doctoral Dissertation of China] ; [Program for New Century Excellent Talents in University] ; [Fundamental Research Funds for the Central Universities] |
| 语种 | 英语 |
| CSCD记录号 | CSCD:4410852 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/157756]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 作者单位 | 1.中国科学院金属研究所 2.上海市地震局 |
| 推荐引用方式 GB/T 7714 | Kang T Y,Xiu Y Y,Hui L,et al. Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect[J]. JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,2011,27(8):741-745. |
| APA | Kang T Y,Xiu Y Y,Hui L,Wang J J,Tong W P,&Liu C Z.(2011).Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect.JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,27(8),741-745. |
| MLA | Kang T Y,et al."Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect".JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY 27.8(2011):741-745. |
入库方式： OAI收割
来源：金属研究所
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