The application of the scallop nanostructure in deep silicon etching
文献类型：期刊论文
| 作者 | Lin, Yuanwei; Yuan, Renzhi; Zhou, Ce; Dong, Zihan; Su, Ziduo; Zhang, Haimiao; Chen, Zhenpeng; Li, Yunyun; Wang, Chun |
| 刊名 | NANOTECHNOLOGY
 |
| 出版日期 | 2020-07-31 |
| 卷号 | 31期号:31页码:1-11 |
| 关键词 | deep silicon etching Bosch process scallop nanostructure fluorocarbon polymer minimum effect |
| ISSN号 | 0957-4484 |
| 英文摘要 | Micro/nanostructures with high aspect ratios in silicon wafers obtained by plasma etching are of great significance in device fabrication. In most cases, the scallop nanostructure in deep silicon etching should be suppressed. However, the scallop nanostructure could be applied in electronic device fabrication as characteristic information, which indicates the balance between deposition and etching. In this work, the applications of scallop nanostructures in etching process optimization and environmental protection are demonstrated. In addition, the minimum effect of the cycle time on the scallop size is reported for the first time. These results could bring new thoughts to the electronic devices related fields, such as micro-electro-mechanical systems (MEMS), silicon capacitors and advanced packaging. |
| 源URL | [http://ir.rcees.ac.cn/handle/311016/44820]  |
| 专题 | 生态环境研究中心_环境化学与生态毒理学国家重点实验室 |
| 推荐引用方式 GB/T 7714 | Lin, Yuanwei,Yuan, Renzhi,Zhou, Ce,et al. The application of the scallop nanostructure in deep silicon etching[J]. NANOTECHNOLOGY,2020,31(31):1-11. |
| APA | Lin, Yuanwei.,Yuan, Renzhi.,Zhou, Ce.,Dong, Zihan.,Su, Ziduo.,...&Wang, Chun.(2020).The application of the scallop nanostructure in deep silicon etching.NANOTECHNOLOGY,31(31),1-11. |
| MLA | Lin, Yuanwei,et al."The application of the scallop nanostructure in deep silicon etching".NANOTECHNOLOGY 31.31(2020):1-11. |
入库方式： OAI收割
来源：生态环境研究中心
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