Electronic conductive and corrosion mechanisms of dual nanostructure CuCr-doped hydrogenated carbon films for SS316L bipolar plates
文献类型:期刊论文
作者 | Qian Jia3,4; Zhixing Mou2; Xingkai Zhang3,4; Bin Zhang3,4; Ruixuan Liu1; Kaixiong Gao3,4; Yuanlie Yu3,4; Zhengguo Lai3,4; Junyan Zhang3,4 |
刊名 | Materials Today Chemistry |
出版日期 | 2021-07-30 |
期号 | 21页码:100521 |
DOI | https://doi.org/10.1016/j.mtchem.2021.100521 |
源URL | [http://ir.licp.cn/handle/362003/27631] |
专题 | 兰州化学物理研究所_先进润滑与防护材料研究发展中心 兰州化学物理研究所_固体润滑国家重点实验室 |
作者单位 | 1.College of Petrochemical Technology, Lanzhou University of Technology 2.Institute of Crystalline Materials, Institute of Molecular Science, Shanxi University 3.Center of Materials Science and Optoelectronics Engineering 4.Key Laboratory of Science and Technology on Wear and Protection of Materials |
推荐引用方式 GB/T 7714 | Qian Jia,Zhixing Mou,Xingkai Zhang,et al. Electronic conductive and corrosion mechanisms of dual nanostructure CuCr-doped hydrogenated carbon films for SS316L bipolar plates[J]. Materials Today Chemistry,2021(21):100521. |
APA | Qian Jia.,Zhixing Mou.,Xingkai Zhang.,Bin Zhang.,Ruixuan Liu.,...&Junyan Zhang.(2021).Electronic conductive and corrosion mechanisms of dual nanostructure CuCr-doped hydrogenated carbon films for SS316L bipolar plates.Materials Today Chemistry(21),100521. |
MLA | Qian Jia,et al."Electronic conductive and corrosion mechanisms of dual nanostructure CuCr-doped hydrogenated carbon films for SS316L bipolar plates".Materials Today Chemistry .21(2021):100521. |
入库方式: OAI收割
来源:兰州化学物理研究所
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