中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Quasi-isotropically thermoconductive, antiwear and insulating hierarchically assembled hexagonal boron nitride nanosheet/epoxy composites for efficient microelectronic cooling

文献类型:期刊论文

作者An Lulu3,4; Zhang Nan3,4; Zeng Xiaoliang2; Zhong Bo1; Yu YL(于元烈)3,4
刊名Journal of Colloid and Interface Science
出版日期2021-10
期号608页码:1907-1918
资助项目六方氮化硼基薄膜表面结构性能调控及摩擦磨损机制
源URL[http://ir.licp.cn/handle/362003/27705]  
专题兰州化学物理研究所_先进润滑与防护材料研究发展中心
通讯作者Yu YL(于元烈)
作者单位1.School of Materials Science and Engineering, Harbin Institute of Technology at Weihai
2.Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences
3.Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences
4.Key Laboratory of Science and Technology on Wear and Protection of Materials, Lanzhou Institute of Chemical Physics, Chinese Academy of Sciences
推荐引用方式
GB/T 7714
An Lulu,Zhang Nan,Zeng Xiaoliang,et al. Quasi-isotropically thermoconductive, antiwear and insulating hierarchically assembled hexagonal boron nitride nanosheet/epoxy composites for efficient microelectronic cooling[J]. Journal of Colloid and Interface Science,2021(608):1907-1918.
APA An Lulu,Zhang Nan,Zeng Xiaoliang,Zhong Bo,&Yu YL.(2021).Quasi-isotropically thermoconductive, antiwear and insulating hierarchically assembled hexagonal boron nitride nanosheet/epoxy composites for efficient microelectronic cooling.Journal of Colloid and Interface Science(608),1907-1918.
MLA An Lulu,et al."Quasi-isotropically thermoconductive, antiwear and insulating hierarchically assembled hexagonal boron nitride nanosheet/epoxy composites for efficient microelectronic cooling".Journal of Colloid and Interface Science .608(2021):1907-1918.

入库方式: OAI收割

来源:兰州化学物理研究所

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