Quantitative mechanisms behind the synchronous increase of strength and electrical conductivity of cold-drawing oxygen-free Cu wires
文献类型：期刊论文
| 作者 | Sun, P. F.2; Zhang, P. L.2; Hou, J. P.1; Wang, Q.1; Zhang, Z. F.1 |
| 刊名 | JOURNAL OF ALLOYS AND COMPOUNDS
 |
| 出版日期 | 2021-05-15 |
| 卷号 | 863页码:9 |
| 关键词 | Oxygen-free Cu wire Cold-drawing Strength Electrical conductivity |
| ISSN号 | 0925-8388 |
| DOI | 10.1016/j.jallcom.2021.158759 |
| 通讯作者 | Zhang, P. L.(zhangpl@lut.edu.cn) ; Hou, J. P.(jphou@imr.ac.cn) ; Zhang, Z. F.(zhfzhang@imr.ac.cn) |
| 英文摘要 | High strength and high electrical conductivity (EC) are the key performance for Cu wire. However, the trade-off relation between the strength and the electrical conductivity limits the application of high-performance Cu wires. In the study, the simultaneous increase of strength and electrical conductivity was found in the oxygen-free Cu wire (OFCW) manufactured by cold-drawing process. The results show that the dislocation, texture and grain are three main factors influencing the strength and electrical conductivity of the cold-drawing OFCWs. Moreover, the contribution of microstructures to strength and electrical conductivity was calculated quantitatively. Three strengthening mechanisms including dislocation, grain boundary and < 111 > texture strengthening are considered to be the main factors that strengthen the colddrawing OFCWs. Besides, the elongated grains and the dislocation recovery are responsible for the increase of electrical conductivity. Finally, the thin-long grains are revealed to be the key factor leading to the synchronous increase of strength and electrical conductivity. (C) 2021 Elsevier B.V. All rights reserved. |
| 资助项目 | National Natural Science Foundation of China[52001313] ; State Grid Corporation of China[5211HD190002] ; China Postdoctoral Science Foundation[2019M661151] ; LiaoNing Revitalization Talents Program[XLYC1808027] |
| WOS研究方向 | Chemistry ; Materials Science ; Metallurgy & Metallurgical Engineering |
| 语种 | 英语 |
| WOS记录号 | WOS:000621714200104 |
| 出版者 | ELSEVIER SCIENCE SA |
| 资助机构 | National Natural Science Foundation of China ; State Grid Corporation of China ; China Postdoctoral Science Foundation ; LiaoNing Revitalization Talents Program |
| 源URL | [http://ir.imr.ac.cn/handle/321006/161518]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 通讯作者 | Zhang, P. L.; Hou, J. P.; Zhang, Z. F. |
| 作者单位 | 1.Chinese Acad Sci, Fatigue & Fracture Lab Mat, Shi Changxu Innovat Ctr Adv Mat, Inst Met Res, 72 Wenhua Rd, Shenyang 110016, Peoples R China 2.Lanzhou Univ Technol, State Key Lab Adv Proc & Recycling Nonferrous Met, Lanzhou, Peoples R China |
| 推荐引用方式 GB/T 7714 | Sun, P. F.,Zhang, P. L.,Hou, J. P.,et al. Quantitative mechanisms behind the synchronous increase of strength and electrical conductivity of cold-drawing oxygen-free Cu wires[J]. JOURNAL OF ALLOYS AND COMPOUNDS,2021,863:9. |
| APA | Sun, P. F.,Zhang, P. L.,Hou, J. P.,Wang, Q.,&Zhang, Z. F..(2021).Quantitative mechanisms behind the synchronous increase of strength and electrical conductivity of cold-drawing oxygen-free Cu wires.JOURNAL OF ALLOYS AND COMPOUNDS,863,9. |
| MLA | Sun, P. F.,et al."Quantitative mechanisms behind the synchronous increase of strength and electrical conductivity of cold-drawing oxygen-free Cu wires".JOURNAL OF ALLOYS AND COMPOUNDS 863(2021):9. |
入库方式： OAI收割
来源：金属研究所
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