Microstructure and properties of W-Cu/CuCrZr/316L joint bonded by onestep HIP technique
文献类型：期刊论文
| 作者 | R. Wei; Q. Lia; W.J. Wanga; X.L. Wanga,; C.Y. Xie |
| 刊名 | Fusion Engineering and Design
 |
| 出版日期 | 2018 |
| 源URL | [http://ir.hfcas.ac.cn:8080/handle/334002/126116]  |
| 专题 | 合肥物质科学研究院_中科院等离子体物理研究所 |
| 推荐引用方式 GB/T 7714 | R. Wei,Q. Lia,W.J. Wanga,et al. Microstructure and properties of W-Cu/CuCrZr/316L joint bonded by onestep HIP technique[J]. Fusion Engineering and Design,2018. |
| APA | R. Wei,Q. Lia,W.J. Wanga,X.L. Wanga,,&C.Y. Xie.(2018).Microstructure and properties of W-Cu/CuCrZr/316L joint bonded by onestep HIP technique.Fusion Engineering and Design. |
| MLA | R. Wei,et al."Microstructure and properties of W-Cu/CuCrZr/316L joint bonded by onestep HIP technique".Fusion Engineering and Design (2018). |
入库方式： OAI收割
来源：合肥物质科学研究院
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。