Microstructure and properties of W-Cu/CuCrZr/316L joint bonded by onestep HIP technique
文献类型：期刊论文
| 作者 | R. Wei, Q. Li (李强)
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| 刊名 | Fusion Engineering and Design
 |
| 出版日期 | 2018 |
| 源URL | [http://ir.hfcas.ac.cn:8080/handle/334002/126119]  |
| 专题 | 合肥物质科学研究院_中科院等离子体物理研究所 |
| 通讯作者 | R. Wei, Q. Li (李强) |
| 推荐引用方式 GB/T 7714 | R. Wei, Q. Li . Microstructure and properties of W-Cu/CuCrZr/316L joint bonded by onestep HIP technique[J]. Fusion Engineering and Design,2018. |
| APA | R. Wei, Q. Li .(2018).Microstructure and properties of W-Cu/CuCrZr/316L joint bonded by onestep HIP technique.Fusion Engineering and Design. |
| MLA | R. Wei, Q. Li ."Microstructure and properties of W-Cu/CuCrZr/316L joint bonded by onestep HIP technique".Fusion Engineering and Design (2018). |
入库方式： OAI收割
来源：合肥物质科学研究院
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