Design of high density modularity TDI CCD imaging system;TDI CCD
文献类型：期刊论文
| 作者 | Sun, Zhenya ; Liu, Dongbin; Fang, Wei; Zhang, Da
|
| 刊名 | Hongwai yu Jiguang Gongcheng/Infrared and Laser Engineering
 |
| 出版日期 | 2018 |
| 卷号 | 47期号:6 |
| ISSN号 | 10072276 |
| 关键词 | Computer control systems Cameras Charge coupled devices Data acquisition Field programmable gate arrays (FPGA) Image enhancement Imaging systems Integrated circuit design Multichip modules Remote sensing Thick films |
| DOI | 10.3788/IRLA201847.0618001 |
| 英文摘要 | In order to improve the high density assembly technology of remote sensing camera, a high density TDI CCD imaging system was designed with multichip module technology. First, TDI CCD focal plane with mechanical splicing technology was made to a copied unit. Then, the output energy of CCD output image signals was improved by a transistor emitter follower, they were transmitted to the analog front-end chips. Then they were converted into the 14 bits digital signals. After that they were integrated and processed through field programmable gate array (FPGA). In the end, through TLK2711 high-speed chip they were sent to data acquisition card on the computer. All the driving signals and processing signals of the imaging system were produced by the FPGA. The computer can control the imaging system and exchange the parameter through RS422 communication bus. The experimental results show that the area of driving layout cut down 2/3 than convention design. It realized the camera' s high density assembly adopting the design of the mechanical and electrical integration of heat. And the total data speed can reach 3.6 Gbps in this imaging system, SNR can reach 52.6 dB. 2018, Editorial Board of Journal of Infrared and Laser Engineering. All right reserved. |
| 源URL | [http://ir.ciomp.ac.cn/handle/181722/60616]  |
| 专题 | 中国科学院长春光学精密机械与物理研究所 |
| 推荐引用方式 GB/T 7714 | Sun, Zhenya,Liu, Dongbin,Fang, Wei,et al. Design of high density modularity TDI CCD imaging system;TDI CCD[J]. Hongwai yu Jiguang Gongcheng/Infrared and Laser Engineering,2018,47(6). |
| APA | Sun, Zhenya,Liu, Dongbin,Fang, Wei,&Zhang, Da.(2018).Design of high density modularity TDI CCD imaging system;TDI CCD.Hongwai yu Jiguang Gongcheng/Infrared and Laser Engineering,47(6). |
| MLA | Sun, Zhenya,et al."Design of high density modularity TDI CCD imaging system;TDI CCD".Hongwai yu Jiguang Gongcheng/Infrared and Laser Engineering 47.6(2018). |
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