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Applying the plasma physical sputtering process to SRF cavity treatment: Simulation and Experiment Study

文献类型：期刊论文

作者Zhu, Tongtong2,3; Luo, Didi3; Wu, Andong2,3; Tan, Teng2,3; Guo, Hao3; Xiong, Pingran3; Lin, Zeqiang2,3; Huang, Shichun3; Chu, Qingwei3; Yang, Ziqin3
刊名APPLIED SURFACE SCIENCE
出版日期2022-02-01
卷号574页码:10
ISSN号0169-4332
关键词SRF cavities Plasma processing Self-consistent model Sputtering-yield probability distribution IEDF
DOI10.1016/j.apsusc.2021.151575
通讯作者Wu, Andong(antonwoo@impcas.ac.cn) ; Tan, Teng(ttan@impcas.ac.cn)
英文摘要Plasma processing is a fast-emerging surface treatment technology for superconducting radio frequency (SRF) cavities: plasma interacts with the impurity contamination and tiny burrs, resulting in an etched clean-andsmooth RF surface. Among all the variations of plasma processing method, the physical sputtering process might be applied to SRF cavities but has no clear etching profile (including distribution uniformity, ion flux, energy, and etching rate). To investigate that, this paper utilizes a two-dimensional self-consistent model combining the fluid equations and the Monte Carlo collision method. With the model, we introduced the sputtering-yield probability distribution to evaluate the physical sputtering process quantitatively; optimized the plasma distribution characteristics with three electrode structures to attain uniformly distributed plasma; built the correlation between ion flux and ion-energy distribution function (IEDF) under varied power and frequency; and studied the physical sputtering process at different positions. In the end, we performed the plasma physical sputtering experiment on small niobium samples, seeing an etching and smoothing effect. This research successfully evaluated the physical sputtering process for SRF cavities, and indicated the feasibility of pure physical sputtering etching.
WOS关键词CROSS-SECTIONS ; IMPACT ; ARGON
资助项目National Natural Science Foundation of China[12105335] ; Sichuan Science and Technology Program[2020YFSY000] ; Scientific Instrument Development Project of Chinese Academy of Sciences[E028861Y]
WOS研究方向Chemistry ; Materials Science ; Physics
语种英语
出版者ELSEVIER
WOS记录号WOS:000729147900003
资助机构National Natural Science Foundation of China ; Sichuan Science and Technology Program ; Scientific Instrument Development Project of Chinese Academy of Sciences
源URL[http://119.78.100.186/handle/113462/140105]  
专题中国科学院近代物理研究所
通讯作者Wu, Andong; Tan, Teng
作者单位1.Sichuan Univ, Inst Nucl Sci & Technol, Chengdu 610064, Peoples R China
2.Univ Chinese Acad Sci, Sch Nucl Sci & Technol, Beijing 100049, Peoples R China
3.Chinese Acad Sci, Inst Modern Phys, Lanzhou 730000, Peoples R China
推荐引用方式
GB/T 7714		 Zhu, Tongtong,Luo, Didi,Wu, Andong,et al. Applying the plasma physical sputtering process to SRF cavity treatment: Simulation and Experiment Study[J]. APPLIED SURFACE SCIENCE,2022,574:10.
APA Zhu, Tongtong.,Luo, Didi.,Wu, Andong.,Tan, Teng.,Guo, Hao.,...&He, Yuan.(2022).Applying the plasma physical sputtering process to SRF cavity treatment: Simulation and Experiment Study.APPLIED SURFACE SCIENCE,574,10.
MLA Zhu, Tongtong,et al."Applying the plasma physical sputtering process to SRF cavity treatment: Simulation and Experiment Study".APPLIED SURFACE SCIENCE 574(2022):10.

入库方式： OAI收割

来源：近代物理研究所

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