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Dual-method molding of 4D shape memory polyimide ink

文献类型：期刊论文

作者Li, Xiao1,2; Yang, Yangyang3; Zhang, Yaoming1; Wang, Tingmei1; Yang, Zenghui1; Wang, Qihua1,2; Zhang, Xinrui1
刊名MATERIALS & DESIGN
出版日期2020-06-01
卷号191页码:11
关键词4D shape memory polyimides Extrusion molding 3D printing Printing
ISSN号0264-1275
DOI10.1016/j.matdes.2020.108606
通讯作者Yang, Zenghui(yangzh@licp.cas.cn) ; Zhang, Xinrui(xruiz@licp.cas.cn)
英文摘要Thermoset shape memory polyimides (TPIs) are widely used in the fields of high-temperature smart devices. However, the recent molding of polyimides limits most of potentials in the form of two-dimensional film. In this work, we synthesized a novel shape memory polyimide (SMPI) ink that could be used for both Digital Light Process and extrusion molding 3D printing. Through UV-induced free radical polymerization, 3D custom polyimides ink can be cured rapidly. Remarkably, the 3D printed PI exhibits excellent shape memory performance, with R-f of 99.8%, R-r of 98.3%, therefore the 4D printing PI was successfully prepared. The 3D printed airplane, ultrasonic motor and pagoda can actively recover the film folding, expanding combined compressing, and vertical distorting to their permanent shape, which presents the outstanding 4D printing properties. Moreover, SMPI can be used in extrusion molding to print films, the residual stress induced the self-folding and then a vector model was applied to characterize transformation of extruded plates. In order to develop the application diversity of extruded 4D polyimide, self-folding box and stimuli-response gripper are designed, the gripper is able to pull up steel ball 15 times heavier than itself. Thus, SMPI will be benefit to expand the applied scope of SMPI. (C) 2020 Published by Elsevier Ltd.
WOS关键词POLYMER ; COMPOSITES ; FABRICATION ; NETWORKS ; BEHAVIOR ; PH
资助项目Youth Innovation Promotion Association of Chinese Academy of Science[2018457] ; National Natural Science Foundation of China[51875549] ; National Natural Science Foundation of China[51935012] ; National Natural Science Foundation of China[51673205] ; Key Research Program of Frontier Science, Chinese Academy of Sciences[QYZDJ-SSW-SLH056]
WOS研究方向Materials Science
语种英语
WOS记录号WOS:000536937200027
出版者ELSEVIER SCI LTD
资助机构Youth Innovation Promotion Association of Chinese Academy of Science ; National Natural Science Foundation of China ; Key Research Program of Frontier Science, Chinese Academy of Sciences
源URL[http://119.78.100.186/handle/113462/140770]  
专题中国科学院近代物理研究所
通讯作者Yang, Zenghui; Zhang, Xinrui
作者单位1.Chinese Acad Sci, State Key Lab Solid Lubricat, Lanzhou Inst Chem Phys, Lanzhou 730000, Peoples R China
2.Univ Chinese Acad Sci, Ctr Mat Sci & Optoelect Engn, Beijing 100049, Peoples R China
3.Chinese Acad Sci, Inst Modern Phys, Lanzhou 730000, Peoples R China
推荐引用方式
GB/T 7714		 Li, Xiao,Yang, Yangyang,Zhang, Yaoming,et al. Dual-method molding of 4D shape memory polyimide ink[J]. MATERIALS & DESIGN,2020,191:11.
APA Li, Xiao.,Yang, Yangyang.,Zhang, Yaoming.,Wang, Tingmei.,Yang, Zenghui.,...&Zhang, Xinrui.(2020).Dual-method molding of 4D shape memory polyimide ink.MATERIALS & DESIGN,191,11.
MLA Li, Xiao,et al."Dual-method molding of 4D shape memory polyimide ink".MATERIALS & DESIGN 191(2020):11.

入库方式： OAI收割

来源：近代物理研究所

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