Highly conductive thermal interface materials with vertically aligned graphite-nanoplatelet filler towards: High power density electronic device cooling
文献类型：期刊论文
| 作者 | Wu, Xulei; Wang, Huatao; Wang, Ziao; Xu, Jinglong; Wu, Yajin; Xue, Rui; Cui, Hongxin; Tian, Cong; Wang, Yu; Huang, Xiaoxiao; Zhong, Bo |
| 刊名 | CARBON
 |
| 出版日期 | 2021 |
| 卷号 | 182页码:445-453 |
| 公开日期 | 2021 |
| 源URL | [http://ir.semi.ac.cn/handle/172111/30850]  |
| 专题 | 半导体研究所_半导体超晶格国家重点实验室 |
| 推荐引用方式 GB/T 7714 | Wu, Xulei; Wang, Huatao; Wang, Ziao; Xu, Jinglong; Wu, Yajin; Xue, Rui; Cui, Hongxin; Tian, Cong; Wang, Yu; Huang, Xiaoxiao; Zhong, Bo. Highly conductive thermal interface materials with vertically aligned graphite-nanoplatelet filler towards: High power density electronic device cooling[J]. CARBON,2021,182:445-453. |
| APA | Wu, Xulei; Wang, Huatao; Wang, Ziao; Xu, Jinglong; Wu, Yajin; Xue, Rui; Cui, Hongxin; Tian, Cong; Wang, Yu; Huang, Xiaoxiao; Zhong, Bo.(2021).Highly conductive thermal interface materials with vertically aligned graphite-nanoplatelet filler towards: High power density electronic device cooling.CARBON,182,445-453. |
| MLA | Wu, Xulei; Wang, Huatao; Wang, Ziao; Xu, Jinglong; Wu, Yajin; Xue, Rui; Cui, Hongxin; Tian, Cong; Wang, Yu; Huang, Xiaoxiao; Zhong, Bo."Highly conductive thermal interface materials with vertically aligned graphite-nanoplatelet filler towards: High power density electronic device cooling".CARBON 182(2021):445-453. |
入库方式： OAI收割
来源：半导体研究所
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