中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Effect of microstructure and mechanical properties on the tribological and electrochemical performances of Si/DLC films under HCl

文献类型:期刊论文

作者Lunlin Shang2,3; Chengxue Gou1; Wensheng Li2,3; Dongqing He2,3; Shunhua Wang1
刊名Diamond & Related Materials
出版日期2021-04-09
期号116页码:108385
源URL[http://ir.licp.cn/handle/362003/28029]  
专题兰州化学物理研究所_固体润滑国家重点实验室
通讯作者Wensheng Li; Dongqing He
作者单位1.School of Materials Science and Engineering, Lanzhou Jiaotong University
2.State Key Laboratory of Advanced Processing and Recycling of Nonferrous Metals, Lanzhou University of Technology
3.School of Materials Science and Engineering, Lanzhou University of Technology
推荐引用方式
GB/T 7714
Lunlin Shang,Chengxue Gou,Wensheng Li,et al. Effect of microstructure and mechanical properties on the tribological and electrochemical performances of Si/DLC films under HCl[J]. Diamond & Related Materials,2021(116):108385.
APA Lunlin Shang,Chengxue Gou,Wensheng Li,Dongqing He,&Shunhua Wang.(2021).Effect of microstructure and mechanical properties on the tribological and electrochemical performances of Si/DLC films under HCl.Diamond & Related Materials(116),108385.
MLA Lunlin Shang,et al."Effect of microstructure and mechanical properties on the tribological and electrochemical performances of Si/DLC films under HCl".Diamond & Related Materials .116(2021):108385.

入库方式: OAI收割

来源:兰州化学物理研究所

浏览0
下载0
收藏0
其他版本

除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。