A Novel High-Q Dual-Mass MEMS Tuning Fork Gyroscope Based on 3D Wafer-Level Packaging
文献类型：期刊论文
| 作者 | Xu, Pengfei; Si, Chaowei; He, Yurong; Wei, Zhenyu; Jia, Lu; Han, Guowei; Ning, Jin; Yang, Fuhua |
| 刊名 | SENSORS
 |
| 出版日期 | 2021 |
| 卷号 | 21期号:19页码:6428 |
| 公开日期 | 2021 |
| 源URL | [http://ir.semi.ac.cn/handle/172111/30935]  |
| 专题 | 半导体研究所_半导体集成技术工程研究中心 |
| 推荐引用方式 GB/T 7714 | Xu, Pengfei; Si, Chaowei; He, Yurong; Wei, Zhenyu; Jia, Lu; Han, Guowei; Ning, Jin; Yang, Fuhua. A Novel High-Q Dual-Mass MEMS Tuning Fork Gyroscope Based on 3D Wafer-Level Packaging[J]. SENSORS,2021,21(19):6428. |
| APA | Xu, Pengfei; Si, Chaowei; He, Yurong; Wei, Zhenyu; Jia, Lu; Han, Guowei; Ning, Jin; Yang, Fuhua.(2021).A Novel High-Q Dual-Mass MEMS Tuning Fork Gyroscope Based on 3D Wafer-Level Packaging.SENSORS,21(19),6428. |
| MLA | Xu, Pengfei; Si, Chaowei; He, Yurong; Wei, Zhenyu; Jia, Lu; Han, Guowei; Ning, Jin; Yang, Fuhua."A Novel High-Q Dual-Mass MEMS Tuning Fork Gyroscope Based on 3D Wafer-Level Packaging".SENSORS 21.19(2021):6428. |
入库方式： OAI收割
来源：半导体研究所
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